We found that carbon-associated byproducts formed at the dry-oxidized SiO2/SiC(0001) interface could be decomposed and be taken out to the SiO2 side by high-purity Ar annealing. We evaluated the concentration of the ejected carbon atoms in the SiO2 by secondary ion mass spectrometry, and discovered that it clearly depends on the condition of oxide formation (dry-oxidation, nitridation treatment, and phosphorus treatment). This work provides an indirect but unambiguous evidence for the carbon-byproducts existing at the SiO2/SiC interfaces, and also indicates that the phosphorus treatment removes the carbon-byproducts, leading to significant reduction of interface defects.
Silicon-on-insulator (SOI) substrates can reduce radiofrequency (RF) substrate losses due to their buried oxide (BOX). On the other hand, the BOX causes problems since it acts as a thermal barrier. Oxide has low thermal conductivity and traps heat generated by devices on the SOI. This paper presents a hybrid substrate which uses a thin layer of polycrystalline silicon and polycrystalline silicon carbide (Si-on-poly-SiC) to replace the thermally unfavorable BOX and the silicon substrate. Substrates of 150 mm were fabricated by wafer bonding and shown to be stress and strain free. Various electronic devices and test structures were processed on the hybrid substrate as well as on a low-resistivity SOI reference wafer. The substrates were characterized electrically and thermally and compared with each other. Results showed that the Si-on-poly-SiC wafer had 2.5 times lower thermal resistance and exhibited equal or better electrical performance compared with the SOI reference wafer.
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