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Holograms display a 3D image in high resolution and allow viewers to focus freely as if looking through a virtual window, yet computer generated holography (CGH) hasn't delivered the same visual quality under plane wave illumination and due to heavy computational cost. Light field displays have been popular due to their capability to provide continuous focus cues. However, light field displays must trade off between spatial and angular resolution, and do not model diffraction. We present a light field-based CGH rendering pipeline allowing for reproduction of high-definition 3D scenes with continuous depth and support of intra-pupil view-dependent occlusion. Our rendering accurately accounts for diffraction and supports various types of reference illuminations for hologram. We avoid under- and over-sampling and geometric clipping effects seen in previous work. We also demonstrate an implementation of light field rendering plus the Fresnel diffraction integral based CGH calculation which is orders of magnitude faster than the state of the art [Zhang et al. 2015], achieving interactive volumetric 3D graphics. To verify our computational results, we build a see-through, near-eye, color CGH display prototype which enables co-modulation of both amplitude and phase. We show that our rendering accurately models the spherical illumination introduced by the eye piece and produces the desired 3D imagery at the designated depth. We also analyze aliasing, theoretical resolution limits, depth of field, and other design trade-offs for near-eye CGH.

Electrical Integrity of State-of-the-Art 0.13 prn SO1 CMOS Devices a n d Circuits T r a n s f e r r e d f o r Three-Dimensional (3D) I n t e g r a t e d C i r c u i t (IC) Fabrication AbstractWe introduce a new scheme for building threedimensional (3D) integrated circuits (ICs) based on the layer transfer of completed devices. We demonstrate for the fmt time that the processes required for stacking active device layers preserve the intrinsic electrical characteristics of stateof-the-art short-channel MOSFETs and ring oscillator circuits, which is critical to the success of high performance 3D ICs.

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We propose a workflow for spectral reproduction of paintings, which captures a painting's spectral color, invariant to illumination, and reproduces it using multi-material 3D printing. We take advantage of the current 3D printers' capabilities of combining highly concentrated inks with a large number of layers, to expand the spectral gamut of a set of inks. We use a data-driven method to both predict the spectrum of a printed ink stack and optimize for the stack layout that best matches a target spectrum. This bidirectional mapping is modeled using a pair of neural networks, which are optimized through a problem-specific multi-objective loss function. Our loss function helps find the best possible ink layout resulting in the balance between spectral reproduction and colorimetric accuracy under a multitude of illuminants. In addition, we introduce a novel spectral vector error diffusion algorithm based on combining color contoning and halftoning, which simultaneously solves the layout discretization and color quantization problems, accurately and efficiently. Our workflow outperforms the state-of-the-art models for spectral prediction and layout optimization. We demonstrate reproduction of a number of real paintings and historically important pigments using our prototype implementation that uses 10 custom inks with varying spectra and a resin-based 3D printer.

Software vulnerabilities are the root cause of computer security problem. How people can quickly discover vulnerabilities existing in a certain software has always been the focus of information security field. This paper has done research on software vulnerability techniques, including static analysis, Fuzzing, penetration testing. Besides, the authors also take vulnerability discovery models as an example of software vulnerability analysis methods which go hand in hand with vulnerability discovery techniques. The ending part of the paper analyses the advantages and disadvantages of each technique introduced here and talks about the future direction of this field.