The wetting behavior of water on metal surfaces is important for a wide range of industries, for example, in the metallurgical industry during the preparation of metallic nanoparticles or electrochemical or electroless coating preparation from aqueous solutions, as well as in the construction industry (e.g., self-cleaning metal surfaces) and in the oil industry, in the case of water–oil separation or corrosion problems. Wettability in water/metal systems has been investigated in the literature; nevertheless, contradictions can be found in the results. Some papers have reported perfect wettability even in water/noble metal systems, while other researchers state that water cannot spread well on the surface of metals, and the contact angle is predicted at around 60°. The purpose of this paper is to resolve this contradiction and find correlations to predict the contact angle for a variety of metals. In our research, the wetting behavior of distilled water on the freshly polished surface of Ag, Au, Cu, Fe, Nb, Ni, Sn, Ti, and W substrates was investigated by the sessile drop method. The contact angle of the water on the metal was determined by KSV software. The contact angle of water is identified as being between 50° and 80°. We found that the contact angle of water on metals decreases linearly with increasing the atomic radius of the substrate. Using our new equation, the contact angle of water was identified on all of the metals in the periodic table. From the measured contact angle values, the adhesion energy of the distilled water/metal substrate interface was also determined and a correlation with the free electron density parameter of substrates was determined.
The goal of this research is to study the applicability of the diffusion boriding process as a high-temperature thermochemical heat treatment to enhance the lifetime of steel selective soldering tools. The main purpose of the work is to discuss the behavior of double-phase (FeB/Fe2B) iron-boride coating on the surface of different steels (DC04, C45, CK60, and C105U) against the stationary SAC309 lead-free solder liquid alloy. The boride coating was formed on the surface of the steel samples through the powder pack boriding technique. The microstructure of the formed layer was examined by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The borided samples were first cut in half and then immersed into a stationary SAC309 lead-free solder liquid alloy (Sn–3Ag–0.9Cu) for 40 days. Microstructure examinations were performed by SEM with energy-dispersive spectroscopy and an elemental distribution map after the dissolution test. Excessive dissolution/corrosion of the original steel surface was observed at the steel/SAC interfaces, leading also to the formation of Fe–Sn intermetallic phases. This was found to be the major reason for the failure of selective soldering tools made of steel. On the contrary, no dissolution and no intermetallic compounds were observed at the FeB/SAC and at the Fe2B/SAC interfaces; as a result, the thicknesses of the FeB and Fe2B phases remained the same during the 40-day dissolution tests. Thus, it was concluded that both FeB and Fe2B phases show excellent resistance against the aggressive liquid solder alloy. The results of the dissolution tests show a good agreement with the thermodynamic calculations.
In this paper copper nanoparticles (Cu NPs) have been produced by solvothermal method. One of the objectives of the present research was to create Cu NPs using aqueous medium technology. The analysis of the produced particles was performed by X-ray diffraction (XRD) and Scanning Electron Microscopy (SEM). In the course of the experiments, copper core and organic shell nanoparticles were created successfully. It has been found that the average diameter of the created Cu NPs was 50 nm. The thermal behaviour of these particles was investigated by Differential Scanning Calorimetry (DSC). The melting temperature depression of the one-pot synthesized Cu NPs was 633 °C.
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