Transparent conductive electrodes with high surface conductivity, high transmittance in the visible wavelength range, and mechanical compliance are one of the major challenges in the fabrication of stretchable optoelectronic devices. We report the preparation of a transparent conductive electrode (TCE) based on a silver nanowire (AgNW) percolation network modified with graphene oxide (GO). The monatomic thickness, mechanical flexibility, and strong bonding with AgNWs enable the GO sheets to wrap around and solder the AgNW junctions and thus dramatically reduce the inter-nanowire contact resistance without heat treatment or high force pressing. The GO-soldered AgNW network has a figure-of-merit sheet resistance of 14 ohm/sq with 88% transmittance at 550 nm. Its storage stability is improved compared to a conventional high-temperature annealed AgNW network. The GO-soldered AgNW network on polyethylene terephthalate films was processed from solutions using a drawdown machine at room temperature. When bent to 4 mm radius, its sheet resistance was increased by only 2-3% after 12,000 bending cycles. GO solder can also improve the stretchability of the AgNW network. Composite TCE fabricated by inlaying a GO-soldered AgNW network in the surface layer of polyurethane acrylate films is stretchable, by greater than 100% linear strain without losing electrical conductivity. Fully stretchable white polymer light-emitting diodes (PLEDs) were fabricated for the first time, employing the stretchable TCE as both the anode and cathode. The PLED can survive after 100 stretching cycles between 0 and 40% strain and can be stretched up to 130% linear strain at room temperature.

A water-based silver-nanowire (AgNW) ink is formulated for screen printing. Screen-printed AgNW patterns have uniform sharp edges, ≈50 μm resolution, and electrical conductivity as high as 4.67 × 10(4) S cm(-1) . The screen-printed AgNW patterns are used to fabricate a stretchable composite conductor, and a fully printed and intrinsically stretchable thin-film transistor array is also realized.

Solid-state refrigeration offers potential advantages over traditional cooling systems, but few devices offer high specific cooling power with a high coefficient of performance (COP) and the ability to be applied directly to surfaces. We developed a cooling device with a high intrinsic thermodynamic efficiency using a flexible electrocaloric (EC) polymer film and an electrostatic actuation mechanism. Reversible electrostatic forces reduce parasitic power consumption and allow efficient heat transfer through good thermal contacts with the heat source or heat sink. The EC device produced a specific cooling power of 2.8 watts per gram and a COP of 13. The new cooling device is more efficient and compact than existing surface-conformable solid-state cooling technologies, opening a path to using the technology for a variety of practical applications.