This paper describes a new Serializer and Deserializer (SerDes) architecture for mobile camera serial interface CMOS image sensor module. This new SerDes architecture enables the effective transmission of digital packet with a timing controller. For the effective serializing and deserializing operations, we adopted the multiplexing technique with a Double Data Rate (DDR) process. By this technique, we can reduce the clock periods by half. The proposed SerDes structure with its transceiver was fabricated using 0.18um CMOS technology. This proposed circuit was verified by using a Mega pixel Mobile Display Digital Interface (MDDI) Image Sensor Module (ISM) at 500Mbps and also tested over this data rate. And this circuit shows low power consumption of 14mW at the supply voltage of 1.8 V.
Post Sn plating is the popular manufacturing method of TCP, one of the packaging types for an LCD driver IC, due its simplicity: however, it has a critical problem, copper digging.To overcome this problem, film manufacturing companies have used the two-step plating or preplatiog technology. Because another company holds the patent for the twc-step plating technology[l], we developed the new technologies that combined an optimized the existing pre Sn plating process and the new wave shape (wave lead). To improve the existing pre-plating technology, which often induced copper brittleness, we carried out D.O.E. (Design of Experiment) in two steps. In the 1st D.O.E. method, four main factors that affected the Cu properties, the Sn thickness, S R type, and the number of times and temperature of Sn curing, were investigated. The result of the 2nd D.O.E. showed that the optimum S R curing temperature was 140 'c. Also, the optimized pre-plating process additionally decreased the number of lead broken by changing the lead from straight lead to wave lead. From these new developments, the failure rates of lead open and lead cracks were decreased from 0.53 to 0.23 % and from 0.38 to 0.10 %, respectively. The use of wave lead is currently in the process of patent application, and the improvements in yield with the use of these new developments are expected to reduce the assembly cost.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
hi@scite.ai
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.