A ring-shaped low-frequency resonator operating in the in-plane (2,1) mode was designed and fabricated utilizing anodic bonding of a 9-µm-thick single-crystal silicon to a glass substrate. Although the gap between the ring and the driving electrode was relatively large (900 nm), a high quality factor of 4212 at 1.609 MHz was realized. The motional resistance was 1.853 MW. In addition, the resonant frequency was electrically tuned by varying the dc bias of drive electrodes with 21.5 ppm/V. Therefore, it was expected that this resonator could possibly replace low frequency quarts resonators of a few MHz ranges.
In the development of LED lighting and power electronics products, the high output characteristics needed to enhance their performance leads to a temperature rise of the semiconductor elements. Although it is necessary to attach heat sinks to semiconductor chips in order to prevent the chip temperature from rising excessively, it is also desirable for heat sinks to be as light as possible in order to reduce costs.Therefore, we propose a design method for cooling components to reduce their weight while keeping the chip temperature low based on applying a regression formula of the temperature-containing variables related to the size of the components. This paper demonstrates the effectiveness of this design method by comparing measurement data from LED lamps and the predicted value derived from this method.
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