MEMS Tilt Sensor Fabricated Utilizing Anodic Bonding of Thin Silicon Film on Glass Substrate

Suzuki, Kenta; Hata, Takuya; Ioka, Kumiko; Takahashi, Yoshifumi; Tuzi, Teturo; Nishioka, Yasushiro

doi:10.1541/ieejsmas.129.328

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2011

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“…Micro fabrication processing techniques have been continuously progressing to fabricate ultra large scale integrated circuits (ULSI). These silicon micro processing techniques have recently been utilized to fabricate silicon microstructures such as micro-gears [1], microactuators [2], microsprings [3,4], thin membranes [5,6] and others to be used in micro electro mechanical systems (MEMS) devices. Silicon has been also regarded as an idealistic spring material with the Young modulus that is nearly sixteen times as large as that of iron [7].…”

Section: Introductionmentioning

confidence: 99%

Silicon Microfabrication Processes Including Anodic Bonding of Extremely Thin (60 μm –Thick) Silicon on Glass

Nara

Oku

Fukai

et al. 2011

AMR

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A new silicon MEMS process has been proposed utilizing anodic bonding of an extremely thin silicon film (60 m) on a glass substrate, followed by photo lithographically defining micro spring structures on the silicon film and dry etching the silicon film using an inductively coupled plasma (ICP) dry etcher. After that, the underneath glass was selectively etched off using a hydrofluoric (HF) solution to release the micro spring. This technique was successfully applied to a micro vibration detection sensor with the silicon microspring with a cross section of 10 m x 60 m with a length longer than 500 m.

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