Solid phase epitaxially grown GeSn was employed as the platform to assess the eligibility of direct O2 plasma treatment on GeSn surface for passivation of GeSn N-MOSFETs. It has been confirmed that O2 plasma treatment forms a GeSnO(x) film on the surface and the GeSnO(x) topped by in situ Al2O3 constitutes the gate stack of GeSn MOS devices. The capability of the surface passivation was evidenced by the low interface trap density (D(it)) of 1.62 × 10(11) cm(-2) eV(-1), which is primarily due to the formation of Ge-O and Sn-O bonds at the surface by high density/reactivity oxygen radicals that effectively suppress dangling bonds and decrease gap states. The good D(it) not only makes tiny frequency dispersion in the characterization of GeSn MOS capacitors, but results in GeSn N-MOSFETs with outstanding peak electron mobility as high as 518 cm(2)/(V s) which outperforms other devices reported in the literature due to reduced undesirable carrier scattering. In addition, the GeSn N-MOSFETs also exhibit promising characteristics in terms of acceptable subthreshold swing of 156 mV/dec and relatively large I(ON)/I(OFF) ratio more than 4 orders. Moreover, the robust reliability in terms small V(t) variation against high field stress attests the feasibility of using the O2 plasma-treated passivation to advanced GeSn technology.
The effect of annealing temperature on the ferroelectricity of HfAlOx with Al concentration of 4.5% is physically and electrically investigated by metal–ferroelectric–insulator–semiconductor (MFIS) platform.
A thin film of AlON with a nitrogen concentration of 13% was developed as the interfacial layer (IL) of HfZrOx-based ferroelectric field-effect transistor (FeFET) memory devices on a Si substrate. Compared to the conventional SiO2/SiON IL, due to a higher dielectric constant value that allows a smaller voltage drop across it and a larger valence band offset (ΔEv) with respect to Si along with prominent passivation of Si dangling bonds that effectively suppress hole trapping, memory devices with the AlON IL demonstrate a large memory window (MW) of 3.12 V by ±4 V gate voltage sweeping, robust endurance after 105 cycles with a long pulse width of 10−4 s, and a stable MW of 2.95 V up to 10 years, standing out from other HfZrOx-based FeFET memory reported in the literature. Furthermore, the AlON IL can be integrated with HfZrOx in the same atomic layer deposition step, which greatly simplifies the process. From the device performance and process integration points of view, the AlON IL unleashes the potential of FeFET memory by enabling high reliability with a large MW.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.