In this research, a new process that integrates the photoresist melting and soft lithography techniques to fabricate microvessel scaffolds with circular microchannels is proposed. The commercial software COMSOL Multiphysics (formerly known as FEMLAB) is the sought after procedure to optimize the structure of the microvessel scaffold. The photolithographic technique is applied to fabricate the negative photoresist THB-120N (JSR Inc.) based microstructure that is followed by melting to the final replica mold with its structure having convex semicircle cross-section. The replica mold is hence used to replicate PDMS to the top and bottom plates of a microvessel scaffold. These two half plates are bonded after having surface treatment by inductive coupled plasma (ICP) to form the complete scaffold with circular microchannels. Finally, the bovine endothelial cells (BEC) are cultured into the scaffold. Encouraging results by semi-dynamic seeding have been observed in this context, depicting the survival of the cells in the scaffold for up to 4 weeks.
In this research, we present a simple and cost effective soft lithographic process to fabricate polylactic acid (PLA) scaffolds for tissue engineering. In which, the negative photoresist JSR THB-120N was spun on a glass subtract followed by conventional UV lithographic processes to fabricate the master to cast the PDMS elastomeric mold. A thin poly(vinyl alcohol) (PVA) layer was used as a mode release such that the PLA scaffold can be easily peeled off. The PLA precursor solution was then cast onto the PDMS mold to form the PLA microstructures. After evaporating the solvent, the PLA microstructures can be easily peeled off from the PDMS mold. Experimental results show that the desired microvessels scaffold can be successfully transferred to the biodegradable polymer PLA. Encouraging progress in bovine endothelial cells seeding was observed
This work describes a novel, first-year graduate-level analog integrated circuit (IC) design course. The course teaches students analog circuit design; an external manufacturer then produces their designs in three different silicon chips. The students, working in pairs, then test these chips to verify their success. All work is completed within one semester, and the grading cycle in the most recent offering of the course extended from September 2007 to February 2008, when there were 10 students enrolled. The manufacturer's shuttle cycle is 3.5 months. Most students in the course have only a college-level electronics background. The manufacturing process is Taiwan Semiconductor Manufacturing Company's (TSMC) 0.35 mu m CMOS Mixed-Signal 2P4M Polycide 3.3/5 V. The three successful chips consist of a voltage controlled oscillator, a high-performance differential amplifier, and a temperature-independent voltage reference generator. Section VI describes assessment and student feedback as well as proposed course improvement
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