With more widespread applications of nanotechnology, heat dissipation in nanoscale devices is becoming a critical issue. We study the thermal response of wafer-scale hexagonal boron nitride (hBN) layers, which find potential applications as ideal substrates in two dimensional devices. Sapphire-supported thin hBN films, 2′′ in size and of different thicknesses, were grown using metalorganic vapour phase epitaxy. These large-scale films exhibit wrinkles defects and grain boundaries over their entire area. The shift of E 2 g high phonon mode with temperature is analysed by considering the cumulative contribution of anharmonic phonon decay along with lattice thermal expansion, defect, and strain modulation. The study demonstrates that during heat treatment the strain evolution plays a dominating role in governing the characteristics of the wrinkled thinner films. Interestingly we find that both defects and strain determine the spectral line-width of these wafer-scale films. To the end, from Raman line-width, the changes in phonon lifetime in delaminated and as-grown films is estimated. The results suggest the possibility of a reduction in thermal transport in these wafer-scale films compared to their bulk counterpart.

Sapphire-supported hBN films of different thicknesses are grown using metalorganic vapour phase epitaxy technique by following a flow modulation scheme. Though these wafer-scale films are potential candidates for real device applications, they exhibit wrinkling. The wrinkles are a key signature of strain distribution in the films. We utilized Raman imaging to study the residual strain distribution in the wrinkled hBN films. An increase in the overall compressive strain in the films with an increase in the layer thickness is observed and explained. An empirical relation is proposed for estimating the wrinkle mediated strain relaxation from the morphology of the films. Furthermore, we show that the residual strain can be partially released by the delamination of the films.

Recently, the electron mobility in wedge-shaped c-GaN nanowall networks has been estimated to cross the theoretical mobility limit for bulk GaN. Significant blue-shift of the bandgap has also been observed. Both the findings are explained in terms of two-dimensional electron gas (2DEG) formed at the central vertical plane of the walls due to the polarization charges at the two inclined faces. Carrier concentration and mobility have earlier been determined from thermoelectric power and conductivity measurements with the help of a statistical model. Due to the network nature of the system, direct measurements of these quantities from Hall experiments are not possible. Search for a better way to estimate mobility in this system thus becomes important. Since, strain can also lead to the blue-shift of the bandgap, it is also imperative to evaluate carefully the role of strain. Here, using Raman spectroscopy, we have estimated carrier concentration and mobility in these nanowall networks with varied average tip-widths. Depth distribution of strain and luminescence characteristics are also studied. The study reveals that strain has no role in the bandgap enhancement. Moreover, the electron mobility, which is determined from the lineshape analysis of the A1(LO)-plasmon coupled mode in Raman spectra, has been found to be significantly higher than the theoretical limit of mobility for bulk GaN for the same electron concentration. These results thus corroborate the picture of polarization induced vertical 2DEG formation in these walls as predicted theoretically.

No abstract

Wafer-scale thin films of hexagonal boron nitride have exceptional thermal and mechanical properties, which harness the potential use of these materials in two-dimensional electronic, device applications. Along with unavoidable defects, grains, and wrinkles, which develop during the growth process, underlying substrates influence the physical and mechanical properties of these films. Understanding the interactions of these large-scale films with different substrates is, thus, important for the implementation of this 2D system in device fabrication. MOVPE-grown 2 and 30 nm hBN/sapphire films of size 2 in. diameter are delaminated chemically and transferred on quartz, SiO2/Si, and sapphire substrates. The structural characteristics of these films are investigated by employing Raman spectroscopy. Our results suggest that not only the roughness but also the height modulation at the surface of the substrates play a pivotal role in determining substrate-mediated mechanical strain inhomogeneity in these films. The statistical analysis of the spectral parameters provides us with the overall characteristics of the films. Furthermore, a Stark difference in the thermal evolution of strain in these films depending on substrate materials is observed. It has been demonstrated that not only the differential thermal expansion coefficient of the substrates and the films, but also slippage of the latter during the thermal treatment determines the net strain in the films. The role of the slippage is significantly higher in 2 nm films than in 30 nm films. We believe that the observations provide crucial information on the structural characteristics of the substrate-coupled wafer-scale hBN films for their future use in technology.

No abstract

No abstract

No abstract