No abstract

No abstract

The objective of this paper is to effectively use soybean straw biomass resources and decrease the negative effects of using synthetic resin. Soybean straw was ground through a wet process then hot-pressed to make biodegradable fiberboard (bio-board) without any binder. The effect of heating temperature on mechanical properties and dimensional stability performance of produced bio-board was investigated. Bonding quality and chemical changes of the bio-board were also evaluated using scanning electron microscopy (SEM) and Fourier transform infrared (FTIR) spectroscopy. The moisture content decreased from 12.5% to 3.4% with the increase of heating temperature. Meanwhile, most mechanical properties of bio-board improved. However, an excessive heating temperature, especially at 230 °C, did not significantly promote the improvement of most mechanical properties. However, the dimensional stability performance of the bio-board was greatly improved from 140 °C to 230 °C. Overall, the results showed that bio-board could be made by using soybean straw without any synthetic resin. Heating temperature plays a significant role in affecting the properties of bio-board. The refined bio-board is expected to be used as a packaging material, heat insulation in architecture, and mulch film for agricultural purposes.

No abstract

No abstract

No abstract

No abstract

Sugarcane remains to be one of the largest cash crops in the world. Despite its economic benefits, a large amount of bagasse generated from extraction processing ends up as an environmental issue. The utilization of bagasse as fiberboard is introduced as an alternative waste management. However, nowadays, fiberboard is commonly produced by adding chemical adhesive, such as Urea-formaldehyde resin, which is harmful to living things. The current research was conducted to study and produce environmentally friendly fiberboard by relying only on lignocellulose due to hydrogen bond formation. The methods used consisted of cutting, soaking, refining, concentration determination, and forming with various drying temperatures of 110ºC, 130ºC, 150ºC, 170ºC, and 190ºC. Characterizations of flexural and tensile strength were carried out to investigate the feasibility of fiberboard based on the standard of JIS A 5905 (2003). The calculations show that the increase in drying temperature from 110ºC to 190ºC increased the flexural and tensile fracture stress by 24.12-36.87 MPa and 12.89-19.77 MPa respectively with both maximum values obtained by fiberboard 190ºC. By considering the density and moisture content of fiberboards which ranged from 1.0210-1.0164 g/cm 3 and 6.19-4.19% respectively, the results indicate that only fiberboard 110ºC, 130ºC, and 150ºC meet the standard of JIS A 5905 (2003) for high-density fiberboard (HDF) with type of S20 and S25. HDF has applications for exterior siding, interior wall, paneling, and household furniture.