Typical 3D integrated circuit structures based on through-silicon vias (TSVs) are complicated to study and analyze. Therefore, it seems important to find some methods to investigate them. In this paper, a method is proposed to model and compute the time-domain coupling noise in 3D Integrated Circuit (3D-IC) based on TSVs. It is based on the numerical inversion Laplace transform (NILT) method and the chain matrices. The method is validated using some experimental results and the Pspice and Matlab tools. The results confirm the effectiveness of the proposed technique and the noise is analyzed in several cases. It is found that TSV noise coupling is affected by different factors such as source characteristics, horizontal interconnections, and the type of Inputs and Outputs (I/O) drivers.

In this paper, two intelligent methods which are GAs and PSO are used to model noise coupling in a Three-Dimensional Integrated Circuit (3D-IC) based on TSVs. These techniques are rarely used in this type of structure. They allow computing all the elements of the noise model, which helps to estimate the noise transfer function in the frequency and time domain in 3D complicated systems. Noise models include TSVs, active circuits, and substrate, which make them difficult to model and to estimate. Indeed, the proposed approaches based on GA and PSO are robust and powerful. To validate the method, comparisons among the results found by GA, PSO, measurements, and the 3D-TLM method, which presents an analytical technique, are made. According to the obtained simulation and experimental results, it is found that the proposed methods are valid, efficient, precise, and robust.

Computation of the broadband antenna impedance behavior requires the wideband lumped equivalent circuit. This work aims to provide a comprehensive study of broadband antenna equivalent circuit models over broad frequency ranges for Internet of Things (IoT) applications using multiple approaches. The first approach is a Foster approximation, which is based on the antenna-simulated scattering parameters and impedance data. The second concerns a vector-fitting fitting approximation, which is based on the antenna-simulated impedance/admittance data. The studied antenna is modeled based on the radiating element’s geometry and the multifractal slots, in addition to the DGS (Defected Ground Plane) effects. Applying these techniques, wideband lumped equivalent circuits of the antenna have been computed which are in good agreement with measurement data. These models could be useful for the enhancement of the performance of a broadband antenna and its systematic design as well as offering the advantage of saving computation time for full-wave simulations and facilitating the solution of problems that have both an electromagnetic part as well as a circuit part. For further analysis, the Gaussian pulse has been generated to drive a time-domain analysis of the current and power response waveforms antenna behavior under load.

The paper studies a simultaneous switching noise (SSN) in a power distribution network (PDN) with dual supply voltages and two cores. This is achieved by reducing the admittance matrix of the PDN then calculating frequency domain impedance with rational function approximation using vector fitting. This paper presents a method of computing the simultaneous switching noise through a switching current, whose properties and details are described. Thus, the results are discussed and performed using MATLAB and PSpice tools. It demonstrated that the presence of many cores in the same PCB influences the SSN due to electromagnetic coupling.

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