We experimentally studied three types of group-IV-semiconductor quantum-dots (IV-QDs) of Si-, SiC-, and C-QDs in a thermal SiO2 layer that were fabricated using a very simple hot-ion implantation technique for Si+, double Si+/C+, and C+ into the SiO2 layer, respectively, to realize a different wavelength photoluminescence (PL) emission from near-IR to near-UV ranges. TEM analyses newly confirmed both Si- and C-QDs with a diameter of approximately 2–4 nm in addition to SiC-QDs in SiO2. We successfully demonstrated very strong PL emission from three IV-QDs, and the peak photon energies (E PH) (peak PL-wavelength) of Si-, and SiC-, and C-QDs were approximately 1.56 eV (800 nm), 2.5 eV (500 nm), and 3.3 eV (380 nm), respectively. IV-QDs showed that the PL properties strongly depend on the hot-ion doses of Si and C atoms and the post N2 annealing processes. Consequently, it is easy to design peak PL wavelengths by controlling the ion doses of Si+ and C+ implanted into the SiO2 layer.

We experimentally studied the influence of both impurity density and dangling-bond density on PL emissions from group-IV-semiconductor quantum-dots (IV-QDs) of Si and SiC fabricated by hot-ion implantation technique, to improve the PL intensity (IPL) from IV-QDs embedded in two types of insulators of quartz glass (QZ) with low impurity density and thermal-oxide (OX) layers. First, we verified the IPL reduction in the IV-QDs in QZ. However, we demonstrated the IPL enhancement of IV-QDs in doped QZ, which is attributable to multiple-level emission owing to acceptor and donor ion implantations into QZ. Secondly, we confirmed the large IPL enhancement of IV-QDs in QZ and OX, owing to forming gas annealing with H2/N2 mixed gas, which are attributable to the reduction of the dangling-bond density in IV-QDs. Consequently, it is possible to improve the IPL of IV-QDs by increasing impurity density and reducing dangling-bond density.