Cubic titanium nitride (TiN) films preferentially oriented to the (200) lattice plane were deposited onto (111) silicon wafers using an ion beam assisted deposition technique with an electron cyclotron resonance ion source for ionizing nitrogen gas and an electron beam evaporator for evaporating Ti metals. The resistivities of the TiN films were inversely proportional to the average size of the crystallites making up the TiN films and decreased with increasing substrate temperature and film thickness. TiN films thicker than 50 nm had resistivities around 30 µ Ω cm, slightly higher than the resistivities of TiN crystals.
Sulfur ions were implanted into a semi-insulating GaAs wafer at 50 keV at a dose of 1×1015 cm−2. The implanted GaAs wafer was annealed at temperatures of 650–1000 °C for 15 min. Deep levels were measured in regions with carrier concentrations lower than 3×1017 cm−3, after layers of various thicknesses were removed from the surface of the wafer. The dominant defects in samples annealed at temperatures lower than 850 °C were EL2 and EL6, while 1000 °C annealed samples exhibited isolated EL2 and EL3 defects. Isolated EL2 defects were observed in regions of carrier concentrations lower than 1×1017 cm−3, and EL3 defects were observed in regions of carrier concentrations higher than 2×1017 cm−3.
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