Plasmonic nanoslits have great potential for single molecule applications. We report a wafer scale process for these structures using process steps compatible with a standard CMOS fab environment. This process allows a large scale fabrication of designed nanoslits with extremely small gap sizes and lengths tuned to exhibit optical resonances. Moreover, adjacent grating nano-antennas were successfully implemented, generating strong and localized electric fields in the nanoslit. These slits have practical applications in surface enhanced Raman spectroscopy-based molecular sensing and plasmonic tweezers.
A biocompatible packaging process for implantable electronic systems is described, combining biocompatibility and hermeticity with extreme miniaturization. In Phase 1 of the total packaging sequence, all chips are encapsulated in order to realize a bidirectional diffusion barrier, preventing body fluids from leaching into the package, which would cause corrosion, and preventing IC materials such as Cu from diffusing into the body, which would cause various adverse effects. For cost-effectiveness, this hermetic chip sealing is performed as a postprocessing step at the wafer level using modifications of standard clean room (CR) fabrication techniques. Well-known conductive and insulating CR materials are investigated with respect to their biocompatibility, diffusion barrier properties, and sensitivity to corrosion. In Phase 2 of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme using, for example, gold or platinum. For electrodes in direct contact with the tissue after implantation, IrOx metallization is proposed. Phase 3 of device assembly is the final packaging step, during which all system components, such as electronics, passives, a battery, among others, will be interconnected. To provide sufficient mechanical support, all these components are embedded using a biocompatible elastomer such as PDMS.
As 3D integration matures and progress of the success of stacking and packaging is very thin and potentially ultra thin die from place them accurately into a target position packs, gelpaks or onto another wafer) damage to the die. The ability to do this is choice of tooling used to pick the die plus used to hold the wafer during dicing and su steps. Consideration must be given to how physically released from the tape and the size on the tooling used as part of the releaseThe interaction between three differen concepts and settings in combination with fo tapes based on two release mechanism; 1) U driven are studied. Focus is placed on ke namely the condition of the die post pick and chip outs) and the capability to pick a unpicked die on tape while taking the die si is found that the picking of even rel dimensions, such as 20x20mm 2 from bo possible with considerably high throughpu units per hour, when the right process para However, the die placement can cause issue die support. One solution is the usage o where the die is held flat and supported by general, the well known UV tape can succes die picking, where for some applications could be an attractive option.
A novel biocompatible packaging process for implantable electronic systems is described, combining excellent biocompatibility and hermeticity with extreme miniaturization. Biocompatible and clean room compatible materials and integration processes are evaluated and selected for die encapsulation and interconnection. Cytotoxicity, diffusion tests and corrosion tests using DI water and more aggressive bio-fluids demonstrated promising performance of the packaging.
A biocompatible packaging process for implantable electronic systems is described, combining biocompatibility and hermeticity with extreme miniaturization. In a first phase of the total packaging sequence, all chips are encapsulated in order to realize a bi-directional diffusion barrier preventing body fluids to leach into the package causing corrosion, and preventing IC materials such as Cu to diffuse into the body, causing various adverse effects. For cost effectiveness, this hermetic chip sealing is performed as post-processing at wafer level, using modifications of standard clean room (CR) fabrication techniques. Well known conductive and insulating CR materials are investigated with respect to their biocompatibility, diffusion barrier properties and sensitivity to corrosion. In a second phase of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme using eg. gold or platinum. For electrodes being in direct contact with the tissue after implantation, IrOx metallization is proposed. Device assembly is the final packaging step, during which all system components such as electronics, passives, a battery,… will be interconnected. To provide sufficient mechanical support, all these components are embedded using a biocompatible elastomer such as PDMS.
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