We describe the design, construction, and performance ofthe 32x32 Ge:Ga imaging array being built at the University of Arizona for the Multiband Imaging Photometer for SIRTF(MIPS). The array will support a number ofoperational modes in the MIPS instrument including natural background-limited mapping at 70 rim, super-resolution observations at 70 rim, and spectral energy distribution measurements between 50 and 100 m. The array is constructed in a modular manner using eight 4x32 pixel building blocks. To meet the sensitivity and stability requirements, the array must have excellent photometric repeatability, low noise, and robustness to the effects ofthe ionizing radiation environment in space. Key elements in attaining this level ofperformance are the Ge:Ga detectors materials and the cryogenic CRC-696 readout electronics. We present laboratory data for a 16x32 prototype ofthe array, and describe the plans for the construction of the qualification and ifight units.
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This paper presents alignment test results and scene simulator imagery of a 1 x 1280 element, linear assembly comprised of 5 end -butted modules.Each module consists of a silicon readout chip, a 256 element, photovoltaic, HgCdTe detector array and a silicon /sapphire carrier. Resistance Area (RaA) products of 4.2 x 105 ohm -cm2 were achieved with the LPE, shortwave (ac = 2.42 um), HgCdTe detector array operating at 145K. A detector spacing of 30 um and an optical area of 23 x 23 um2 were used. The modules were end -butted with a loss of < 60um (< 1 pixel missing) at the butt joints. Sensor components are described and radiometric test results are summarized. Test assembly alignment verification and scene simulation are emphasized.1. ABSTRACTThis paper presents alignment test results and scene simulator imagery of a 1 x 1280 element, linear assembly comprised of 5 end-butted modules. Each module consists of a silicon readout chip f a 256 element, photovoltaic, HgCdTe detector array and a silicon/sapphire carrier. Resistance Area (RnA-p products of 4.2 x 10 5 ohm-cm 2 were achieved with the LPE, shortwave (A c = 2.42 ym), HgCdTe detector array operating at 145K. A detector spacing of 30 ym and an optical area of 23 x 23 urn 2 were used. The modules were end-butted with a loss of < 60ym (< 1 pixel missing) at the butt joints. Sensor components are described and radiometric test results are summarized. Test assembly alignment verification and scene simulation are emphasized. 1. SPIE Vol. 972 Infrared Technology XIV (1988) / 83 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 06/16/2016 Terms of Use: http://spiedigitallibrary.org/ss/TermsOfUse.aspxSpecifications on the alignment of detector elements in our five module test assembly are exacting. In the along-track direction, all of the pixels on all of the modules are to lie within a zone no more than 9 ym wide. In the crosstrack direction, the gap between end detector elements on adjacent module assemblies is to be 60 ym or less (center to center). * A speed more easily achieved by our translational table, 84 / SPIE Vol. 972 Infrared Technology XIV (1988) Downloaded From: http://proceedings.spiedigitallibrary.org/ on 06/16/2016 Terms of Use: http://spiedigitallibrary.org/ss/TermsOfUse.aspx
A comprehensive program has been developed for the production of focal plane assemblies (FPA) for use on the University ofArizona Near Infrared Camera and Multi-Object Spectrometer (NICMOS) instrument which is to be installed in the Hubble Space Telescope (HST). This paper describes the current schedule, tests to be performed, test conditions and unique test facilities of the flight FPA qualification test program. This test series is intended to validate design, assembly, performance and reliability of flight qualified FPAs.Also described are the design features, performance characteristics and test results obtained with prototype FPAs used as engineering evaluation units prior to committing the ifight qualification units to manufacture. The qualification tests will demonstrate perfonnance margins over and above requirements under operating environmental conditions. Included in the qualification tests are electrical, mechanical and thermal tests. Random vibration tests and mechanical shock tests will be performed at 1.5 times the load level specified for acceptance requirements. The random vibration tests simulate launch conditions and will induce stresses to uncover any potential structural deficiencies that might exist. The mechanical shock tests will simulate potential impacts incurred as a result of handling or transport. The qualification test program is intended to maximize confidence in the quality and integrity of the flight FPAs. 0-8194-1 182-5/93/$6.00 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 07/03/2016 Terms of Use: http://spiedigitallibrary.org/ss/TermsOfUse.aspx
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