This paper presents low-temperature Pb-free soldering technology using Sn-57Bi-1Ag (mass%). Here, the effects of hightemperature annealing on the mechanical properties of the solder such as tensile strength and elongation are investigated. The experimental results show that during annealing, the sizes of both of Sn and Bi phases coarsen, however the mechanical properties do not deteriorate. The deformation behavior of Sn-57Bi-1Ag is found to be dependent on sliding at grain boundaries between Sn and Bi phases, and this behavior remains consistent even after coarsening. The creep strength of solder joint at high temperature is also studied, and it is found that Sn-57Bi-1Ag exhibits superior creep strength at temperature below approximately 100°C compared to the Sn-37Pb (mass%) solder.The thermal cycling test of Sn-57Bi-1Ag solder joint is also conducted under the condition between 0°C and 90°C. The result shows that the length of crack is shorter than Sn-37Pb in the same conditions, which means Sn-57Bi-1Ag is an effective material for low temperature soldering.
A 10-layer recordable optical disc with an inorganic recording material, Bi-Ge-O, was fabricated and the recording characteristics were measured using a Blu-ray Disc-based apparatus with a wavelength of 405 nm and a numerical aperture of 0.85. Practical signal quality was obtained from all the layers at densities of 25 and 32 Gbyte per layer. A 16-layer recordable optical disc was also fabricated and measured. Practical signal quality was also obtained from both the 1st layer and the 16th layer. #
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.