A methodology for electronic non-destructive failure analysis of 3D-ICs is presented. The method is centred on the Electro Optical Terahertz Pulse Reflectometry technique. Through use of 3D Electromagnetic modelling, a Virtual Known Good Device can be established allowing the means to locate faults in a 3D package design. Measured voltage waveforms generated using the Electro Optical Terahertz Pulse Reflectometry technique are presented for a BGA package with an open defect. Measurements are in good agreement with 3D EM simulation results for the same scenario demonstrating the potential of this technique to locate faults quickly and accurately.
This article discusses the concept of a virtual known good device (VKGD) and how it used in the development of advanced 3D packaging. It explains that a VKGD is essentially an electromagnetic model of an IC package, including bumps, interposers, and through-silicon vias. These models, used in conjunction with reflectometry data, help engineers isolate faults in the early stages of IC package development, greatly reducing cycle times.
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