A CdZnTe strip detector large area array (∼ 60 cm2 with 36 detectors) with capabilities for high resolution imaging and spectroscopy has been built as a prototype for a space flight gamma ray burst instrument. The detector array also has applications in nuclear medical imaging. Two dimensional orthogonal strip detectors with 100 gm pitch have been fabricated and tested. Details for the array design, fabrication and evaluation of the detectors will be presented.
A CdZnTe strip detector large area array (∼ 60 cm2 with 36 detectors) with capabilities for high resolution imaging and spectroscopy has been built as a prototype for a space flight gamma ray burst instrument. The detector array also has applications in nuclear medical imaging. Two dimensional orthogonal strip detectors with 100 μm pitch have been fabricated and tested. Details for the array design, fabrication and evaluation of the detectors will be presented.
Wirebonding is the mainstay interconnect for today's integrated circuit product. On an annual basis, over four trillion wirebonds are made [I]. Most of these are made on individually packaged chips using automated wirebonding machines. These machines can bond at rates up to 10 bonds per second and sustain these rates for long periods of time with automated chip handlers and wire spoolers. Because of the standardization of pad metallurgy, wire types, package structures, bond optimization methods, along with the sheer volume of the enterprise, wirebonding of individually packaged parts has achieved significant levels of quality and reliability [ 11. In fact, error rates in this type of situation are approaching the Go-levels [2]. 0-7803-4850-8/98 $1 0.00 0 1 998 IEEE
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