Although MCMs have been used for processor modules for high end computers since the 1970s, it was not until the 1990s that cost effective MCM technologies have been available for complete processor modules in workstations and other moderate cost computers. In the past 5 years, many technology improvements have enhanced the performance ancl dec;.aeased the effective cost of MCMs. Flip-chip, laminated memory, interleaved wirebonds and thin film passive networks have improved performance and packing density. Simplified packages and hybrid interconnect schemes of cofired and deposited interconnects (or laminated and deposited interconnects), as well as several of the aforementioned technologies, have further reduced cost. Case studies will show the benefits of these improvements.
MCM-D technologies can be used to meetthe challenges of designing high performance mixed signal MCMs. Available MCM-D technologies offer special features such as high density wirebonding, high density interconnect, and integral passive components. These features allow designers to optimize key mixed signal performance parameters such as isolation, insertion loss, return loss, and noise. Specific design examples illustrate the impact o f a specific silicon circuit board based MCM-D technology on these performance parameters.
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