As an alternative to vacuum deposition, preparation of highly conductive papers with aluminum (Al) features is successfully achieved by the solution process consisting of Al precursor ink (AlH(3){O(C(4)H(9))(2)}) and low temperature stamping process performed at 110 °C without any serious hydroxylation and oxidation problems. Al features formed on several kinds of paper substrates (calendar, magazine, and inkjet printing paper substrates) are less than ~60 nm thick, and their electrical conductivities were found to be as good as thermally evaporated Al film or even better (≤2 Ω/□). Strong adhesion of Al features to paper substrates and their excellent flexibility are also experimentally confirmed by TEM observation and mechanical tests, such as tape and bending tests. The solution processed Al features on paper substrates show different electrical and mechanical performance depending on the paper type, and inkjet printing paper is found to be the best substrate with high and stable electrical and mechanical properties. The Al conductive papers produced by the solution process may be applicable in disposal paper electronics.
Oxidation behavior of low carbon steel was investigated in oxygen and water vapor using continuous thermogravimetric analysis (TGA). The effect of temperature, oxygen pressure, and water vapor content on the oxidation of the steel was studied. The morphology, composition, and microstructure of oxides formed in moist atmosphere were examined and analyzed by X‐ray diffraction (XRD), scanning electron microscope (SEM), and energy dispersive X‐ray analysis (EDX). The oxidation mechanism was discussed based on oxidation rate, oxide defects, and microstructure of the substrate and oxide layers.
This paper describes a novel dehydrogenation and spheroidization method using in-situ radio frequency (RF) thermal plasma treatment process to prepare spherical titanium (Ti) powders. Polygonal titanium hydride (TiH 2 ) powders were successfully converted into spherical Ti powders and the size of the powders decreased from 30 to 21 µm by means of evaporation at the powder surface during the plasma treatment. Contaminants in the final products were drastically decreased due to the evaporation and emission of vapors during the plasma treatment.
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