Solution Processed Aluminum Paper for Flexible Electronics

Abstract

As an alternative to vacuum deposition, preparation of highly conductive papers with aluminum (Al) features is successfully achieved by the solution process consisting of Al precursor ink (AlH(3){O(C(4)H(9))(2)}) and low temperature stamping process performed at 110 °C without any serious hydroxylation and oxidation problems. Al features formed on several kinds of paper substrates (calendar, magazine, and inkjet printing paper substrates) are less than ~60 nm thick, and their electrical conductivities were found to be as good as thermally evaporated Al film or even better (≤2 Ω/□). Strong adhesion of Al features to paper substrates and their excellent flexibility are also experimentally confirmed by TEM observation and mechanical tests, such as tape and bending tests. The solution processed Al features on paper substrates show different electrical and mechanical performance depending on the paper type, and inkjet printing paper is found to be the best substrate with high and stable electrical and mechanical properties. The Al conductive papers produced by the solution process may be applicable in disposal paper electronics.

Aqueous and Air‐Compatible Fabrication of High‐Performance Conductive Textiles

“…At the moment, conductive textiles can be readily fabricated by depositing a layer of conductive metals on the textile surface by means of techniques such as galvanic deposition, atomic layer deposition, solution process of Al precursor composite, and electroless deposition (ELD). [6][7][8][9][10][11][12][13][14][15][16][17] Among these techniques, ELD is particularly attractive because it does not require expensive fabrication devices and can be carried out under ambient conditions on a large scale. [18][19][20] Previously, we have demonstrated the fabrication of conductive textiles by ELD of Cu and Ni onto various textile surfaces that have been modified with a thin layer of polyelectrolyte brushes.…”

Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating

“…The bending cycles had radii of 5 and 12 mm on the near coil pattern and via hole, respectively. The number of cycles was determined depending on the final product [32][33][34][35][36]. In this case, up to 400,000 cycles were performed to confirm the mechanical stability of the FPCB.…”

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“…Novos métodos e procedimentos surgiram e deram status de pesquisa [6]àárea, despertando especial interesse em técnicas de baixo custo [4,5,[7][8][9][10][11][12][13][14][15]. Atualmente tem-se notado um aumento no número de artigos relacionados a técnicas de produção de PCB usando o papel como substrato [3,7,9,12,14,16], principalmente depois da descoberta do grafeno [10]. Percebe-se inclusive preocupações ambientais no sentido de se utilizar materiais reciclados e avaliar impactos ambientais [3,11].…”