Challenges in the understanding of three-dimensional (3D) brain networks by simultaneously recording both surface and intracortical areas of brain signals remain due to the difficulties of constructing mechanical design and spatial limitations of the implanted sites. Here, we present a foldable and flexible 3D neural prosthetic that facilitates the 3D mapping of complex neural circuits with high spatiotemporal dynamics from the intracortical to cortical region. This device is the tool to map the 3D neural transmission through sophisticatedly designed four flexible penetrating shanks and surface electrode arrays in one integrated system. We demonstrate the potential possibilities of identifying correlations of neural activities from the intracortical area to cortical regions through continuous monitoring of electrophysiological signals. We also exploited the structural properties of the device to record synchronized signals of single spikes evoked by unidirectional total whisker stimulation. This platform offers opportunities to clarify unpredictable 3D neural pathways and provides a next-generation neural interface.
Ultrathin crystalline silicon is widely used as an active material for high‐performance, flexible, and stretchable electronics, from simple passive and active components to complex integrated circuits, due to its excellent electrical and mechanical properties. However, in contrast to conventional silicon wafer‐based devices, ultrathin crystalline silicon‐based electronics require an expensive and rather complicated fabrication process. Although silicon‐on‐insulator (SOI) wafers are commonly used to obtain a single layer of crystalline silicon, they are costly and difficult to process. Therefore, as an alternative to SOI wafers‐based thin layers, here, a simple transfer method is proposed for printing ultrathin multiple crystalline silicon sheets with thicknesses between 300 nm to 13 µm and high areal density (>90%) from a single mother wafer. Theoretically, the silicon nano/micro membrane can be generated until the mother wafer is completely consumed. In addition, the electronic applications of silicon membranes are successfully demonstrated through the fabrication of a flexible solar cell and flexible NMOS transistor arrays.
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