Purpose -To provide an overview of a process for making proper selection of base materials for use in the manufacture of flexible circuits. Design/methodology/approach -The paper provides an introductory review of the desirable attributes for flexible circuit substrates and includes a description of the attribute and its specific role and impact on the finished product. Findings -The paper highlights the importance of making informed materials choices in flexible circuit manufacture. Flexible circuits are an increasingly important member of the family of electronic interconnection technologies and are also the fastest growing. A variety of materials can be used for flexible circuit construction, however, the choice must be tempered by the manufacturing and assembly processes and the application of the finished product.Research limitations/implications -The paper provides a limited overview of the desirable properties of flexible circuit materials and is designed to provide initial background and guidance for making more informed decisions about material choices. Originality/value -This paper provides an overview of the various factors that should be considered in advance of committing to a flex circuit design.
A patterned arrangement of printed wiring utilizing flexible base material with or without flexible coverlayers". The balance of this brief article will hopefully serve to help the reader understand this remarkable interconnection technology and appreciate just how widely the technology can be applied. A patterned arrangement of printed wiring utilizing flexible base material with or without flexible coverlayers (IPC-T-50 Terms and Definitions for Printed Boards).Back bared flex, also known as double access flex, are circuits with a single conductor layer which are processed in Circuit World 25/2 [1999] [6][7][8][9][10]
PurposeTin‐lead solder has been the primary method for connecting electronic components to printed circuit boards since near the time of its inception. Over the last 60 years, solder has proven a viable assembly method over that time and there is a deep understanding of the technology won over years of practice. However, the European Union has banned the use of lead in electronic solder, based on the misguided assumption that lead in electronic solder represented a risk to human health. Aims to describe a new approach to manufacturing electronic assemblies without the use of solder.Design/methodology/approachThe paper discusses how the new era of lead‐free solder has resulted in a host of new problems for the electronics industry, many of which had not been experienced when elemental lead was included in the solder alloy.FindingsElectronics assembly technology literature is rife with articles and papers citing the problems or challenges of lead‐free assembly and proposing new or improved solutions or investigative tool to better unearth the problems of lead‐free. The new process has come to be known as the Occam process, named to honor the fourteenth century English philosopher and logician, William of Occam, whose rigorous thinking and arguments in favor of finding the simplest possible solution served as the inspiration and catalyst for the new approach.Originality/valueThe paper describes a new approach to manufacturing electronic assemblies without the use of solder.
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