Linear, paraelectric (Pb0.72La0.28)TiO3 or PLT(28) thin films with a bandgap>3 eV were deposited on Pt/Ti/SiO2/Si substrates by the sol-gel technique. Specific top-contact metals from two distinct groups (i.e., non-noble or M T and noble or M N; the former being oxidizable transition metals) were selected to understand the electrical nature of the interfaces in terms of electrode dependent energy band diagrams and equivalent circuit models. Using a high sensitivity high-pass filter circuit to evaluate the charging and discharging behavior coupled with results of the thickness and voltage dependence of capacitance, it was determined that M T ( Ni,Cr,Ti) and M N ( Pt,Au,Ag) metals form Ohmic and Schottky contacts, respectively. Supported by thermochemical data and calculations, the ohmic M T- PLT interfaces are envisioned to be of the form: M T-M T O x -n + PLT-n PLT. In contrast, the M N- PLT interfaces may be characterized by a metal work function independent Schottky diode; the surface Fermi level being pinned at the mid-gap. For example, a Schottky barrier height of 1.83 eV and a built-in voltage of 1.3 eV at the Pt-PLT interface were estimated. From low field capacitance measurements, the ratio of interfacial to bulk resistance, R i/R b, was estimated to be 23.
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