Dilute magnetic semiconductor GaN with a Curie temperature above room temperature has been achieved by manganese doping. By varying the growth and annealing conditions of Mn-doped GaN we have identified Curie temperatures in the range of 228–370 K. These Mn-doped GaN films have ferromagnetic behavior with hysteresis curves showing a coercivity of 100–500 Oe. Structure characterization by x-ray diffraction and transmission electron microscopy indicated that the ferromagnetic properties are not a result of secondary magnetic phases.

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Al 0 26 Ga 0 74 N-GaN heterojunction field-effect transistors were grown by metal-organic chemical vapor deposition on high-resistivity 100-mm Si (111) substrates. Van der Pauw sheet resistance of the two-dimensional electron gas was 300 square with a standard deviation of 10 square.Maximum drain current density of 1 A/mm was achieved with a three-terminal breakdown voltage of 200 V. The cutoff frequency and maximum frequency of oscillation were 18 and 31 GHz, respectively, for 0.7-m gate-length devices. When biased at 50 V, a 2.14-GHz continuous wave power density of 12 W/mm was achieved with associated large-signal gain of 15.3 dB and a power-added efficiency of 52.7%. This is the highest power density ever reported from a GaN-based device grown on a silicon substrate, and is competitive with the best results obtained from conventional device designs on any substrate.Index Terms-GaN, heterojunction field-effect transistor (HFET), high electron mobility transistor (HEMT), power density, silicon.

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Full-scale quantum computers require the integration of millions of qubits, and the potential of using industrial semiconductor manufacturing to meet this need has driven the development of quantum computing in silicon quantum dots. However, fabrication has so far relied on electron-beam lithography and, with a few exceptions, conventional lift-off processes that suffer from low yield and poor uniformity. Here we report quantum dots that are hosted at a 28Si/28SiO2 interface and fabricated in a 300 mm semiconductor manufacturing facility using all-optical lithography and fully industrial processing. With this approach, we achieve nanoscale gate patterns with excellent yield. In the multi-electron regime, the quantum dots allow good tunnel barrier control—a crucial feature for fault-tolerant two-qubit gates. Single-spin qubit operation using magnetic resonance in the few-electron regime reveals relaxation times of over 1 s at 1 T and coherence times of over 3 ms.