Poly[(9,))] (TFB) has been widely used as a hole transport layer (HTL) material in cadmium-based quantum dot lightemitting diodes (QLEDs) because of its high hole mobility. However, as the highest occupied molecular orbital (HOMO) energy level of TFB is −5.4 eV, the hole injection from TFB to the quantum dot (QD) layer is higher than 1.5 eV. Such a high oxidation potential at the QD/HTL interface may seriously degrade the device lifetime. In addition, TFB is not resistant to most solvents, which limits its application in inkjet-printed QLED display. In this study, the blended HTL consisting of TFB and cross-linkable small molecular 4,4′-bis(3-vinyl-9H-carbazol-9-yl)-1,1′-biphenyl (CBP-V) was introduced into red QLEDs because of the deep HOMO energy level of CBP-V (−6.2 eV). Compared with the TFB-only devices, the external quantum efficiency (EQE) of devices with the blended HTL improved from 15.9 to 22.3% without the increase of turn-on voltage for spin-coating-fabricated devices. Furthermore, the blended HTL prolonged the T90 and T70 lifetime from 5.4 and 31.1 to 39.4 and 148.9 h, respectively. These enhancements in lifetime are attributed to the low hole-injection barrier at the HTL/QD interface and high thermal stability of the blended HTL after cross-linking. Moreover, the cross-linked blended HTL showed excellent solvent resistance after crosslinking, and the EQE of the inkjet-printed red QLEDs reached 16.9%.
Metal-mesh is one of the contenders to replace indium tin oxide (ITO) as transparent conductive electrodes (TCEs) for optoelectronic applications. However, considerable surface roughness accompanying metal-mesh type of transparent electrodes has been the root cause of electrical short-circuiting for optoelectronic devices, such as organic light-emitting diode (OLED) and organic photovoltaic (OPV). In this work, a novel approach to making metal-mesh TCE has been proposed that is based on hybrid printing of silver (Ag) nanoparticle ink and electroplating of nickel (Ni). By polishing back the electroplated Ni, an extremely smooth surface was achieved. The fabricated Ag/Ni metal-mesh TCE has a surface roughness of 0.17 nm, a low sheet resistance of 2.1 Ω/□, and a high transmittance of 88.6%. The figure of merit is 1450, which is 30 times better than ITO. In addition, the Ag/Ni metal-mesh TCE shows outstanding mechanical flexibility and environmental stability at high temperature and humidity. Using the polished Ag/Ni metal-mesh TCE, a flexible quantum dot light-emitting diode (QLED) was fabricated with an efficiency of 10.4 cd/A and 3.2 lm/W at 1000 cd/m.
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