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The deformation behavior of 7005 alloy was studied by hot compression tests. The processing map was constructed by superimposing the instability map over the power dissipation map at a strain of 0.7 using the corrected flow stress data to eliminate the effect of friction. Microstructural examination was performed for validation. It can be found that the flow stresses increase with the decrease of deformation temperature or the increase of strain rate. At the relatively high strain rates, the material exhibits flow instability manifesting as adiabatic shear bands or flow localization. A large volume of coarse precipitations distributing in the grain boundaries in one of the peak efficiency domains: 275-325 °C/0.0005-0.001 s −1 , which may result in inter-granular corrosion and spalling layer, should be avoided in the final deformed alloy. The optimum hot working domain is the temperature range of 400-450 °C and strain rate range of 0.0005-0.005 s −1 , at which DRX is identified.

In article number 2001561, Ming Huang, Feng Zhu, Oliver G. Schmidt, and co‐workers develop a costeffective stamping strategy for scalable and rapid preparation of graphene‐based flexible micro‐supercapacitors. The efficient production of the flexible micro‐supercapacitor devices with outstanding shape diversity, high areal capacitance and excellent cycling stability shows great potential for future applications in portable and wearable electronics.

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