MIS capacitors prepared on the (NH4)2S-treated GaAs substrate showed a marked reduction in the density of the dominant pinning levels near 0.6 eV below the conduction band. The annealing effect on the interface characteristics was also investigated. Analyses by means of secondary ion mass spectroscopy (SIMS) and Auger electron spectroscopy (AES) indicate that sulfur atoms at the interface stabilize the oxygen-free GaAs surface both electronically and thermally.
Dependence of the quality of thin films of Al2O3 on the growth temperature was investigated in the surface reaction limited growth system. It has been found that the density, the chemical bonding strength, and the electrical properties improve significantly with increasing growth temperature although the growth rate remains nearly constant. Also, Fourier transform infrared spectroscopy indicates that hydrogen incorporation into the films is nearly negligible.
We have found that treatment with a solution of ammonium sulfide containing excess sulfur [(NH4) 2Sx] produced a stabilized surface of GaAs. The treated surface is covered with a monomolecular layer of sulfur, and oxygen atoms are prohibited from adsorbing chemically on this surface. We checked the durability of the treated surface to heat treatment to find that it was stable up to more than 500 °C. Epitaxial growth of an Al film was demonstrated on the (NH4) 2Sx-treated surface. The presence of sulfur atoms at the interface by this treatment was found to suppress the chemical reaction between the metal and GaAs. Low temperature GaAs epitaxy was demonstrated on the sulfide treated surface without conventional heat treatment. The surface treatment correlates with changes in Schottky barrier height with various metals, which suggests that the surface states of GaAs are decreased remarkably.
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