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Thin films deposited on substrates are usually submitted to large residual compression stresses, causing delamination and buckling of the film into various patterns. The present study is focused on the different equilibria arising on strip-shaped delaminated areas. The three most common types of buckling patterns observed on such strips are known as the straight-sided wrinkles, bubble pattern, and telephone cord blisters. The stability of those equilibria as a function of the two stress components of the loading is investigated. The Föppl-Von Karman model for elastic plates is used for theoretical aspects. The post-critical equilibrium paths of the buckling patterns are investigated numerically by means of the finite-element method. The substrate is assumed to be rigid and the contact to be frictionless. The equilibrium solutions can be classified into families of homologous equilibria allowing the identification of dimensionless parameters for the study of stability. A mapping of the different stable post-critical equilibria is given. It is shown that the straight-sided wrinkles and the bubbles are associated with anisotropy of stresses and/or of elastic properties, whereas the telephone cords are stable at high isotropic stresses. The morphological transitions are experimentally evidenced by in situ atomic force microscopy observations of a nickel 50-nm-thick film under stress.

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We have developed a kinetic model for residual stress generation in thin films grown from energetic vapor fluxes, encountered, e.g., during sputter deposition. The new analytical model considers sub-surface point defects created by atomic peening, along with processes treated in already existing stress models for non-energetic deposition, i.e., thermally activated diffusion processes at the surface and the grain boundary. According to the new model, ballistically induced sub-surface defects can get incorporated as excess atoms at the grain boundary, remain trapped in the bulk, or annihilate at the free surface, resulting in a complex dependence of the steady-state stress on the grain size, the growth rate, as well as the energetics of the incoming particle flux. We compare calculations from the model with in situ stress measurements performed on a series of Mo films sputter-deposited at different conditions and having different grain sizes. The model is able to reproduce the observed increase of compressive stress with increasing growth rate, behavior that is the opposite of what is typically seen under non-energetic growth conditions. On a grander scale, this study is a step towards obtaining a comprehensive understanding of stress generation and evolution in vapor deposited polycrystalline thin films.

The Volmer-Weber growth of high-mobility metal films is associated with the development of a complex compressive-tensile-compressive stress behavior as the film deposition proceeds through nucleation of islands, coalescence, and formation of a continuous layer. The tensile force maximum has been attributed to the end of the islands coalescence stage, based on ex situ morphological observations. However, microstructural rearrangements are likely to occur in such films during post-deposition, somewhat biasing interpretations solely based on ex situ analysis. Here, by combining two simultaneous in situ and real-time optical sensing techniques, based on surface differential reflectance spectroscopy (SDRS) and change in wafer curvature probed by multibeam optical stress sensor (MOSS), we provide direct evidence that film continuity does coincide with tensile stress maximum during sputter deposition of a series of metal (Ag, Au, and Pd) films on amorphous SiOx. Stress relaxation after growth interruption was testified from MOSS, whose magnitude scaled with adatom mobility, while no change in SDRS signal could be revealed, ruling out possible changes of the surface roughness at the micron scale.

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Atomic force microscopy observations of the free surface of gold thin films deposited on silicon substrates have evidenced the buckling of the films and the formation of blister patterns undergoing plastic folding. The classical elastic buckling and plastic deformation of the films are analyzed in the framework of the Föppl-Von Kármán theory of thin plates introducing the notion of low-angle tilt boundaries and dislocation distributions to describe this folding effect. It is demonstrated that, in agreement with elementary plasticity of bent crystals, the presence of such tilt-boundaries results in the formation of buckling patterns of lower energy than "classical" elastic blisters.