Laser-induced forward transfer (LIFT) is a direct-writing technique that allows printing inks from a liquid film in a similar way to inkjet printing but with fewer limitations concerning ink viscosity and loading particle size. In this work, we prove that liquid inks can be printed through LIFT by using continuous wave (CW) instead of pulsed lasers, which allows a substantial reduction in the cost of the printing system. Through the fabrication of a functional circuit on both rigid and flexible substrates (plastic and paper), we provide a proof-of-concept that demonstrates the versatility of the technique for printed electronics applications.

Laser-induced forward transfer (LIFT) is a printing technique based on the action of a laser pulse that is focused on a thin film of a precursor ink for getting the transfer of a droplet onto a receiver substrate. The experiments presented in this article aim to demonstrate the ability of LIFT to produce electronic circuits on paper, a substrate that is flexible, cheap and recyclable. Tests were conducted in order to study the printing of conductive tracks with an Ag ink. The printing of a suspension of carbon nanofibers (CNFs) was also studied in order to demonstrate the ability of LIFT for printing inks with particles with some microns in size that provoke inkjet nozzles to clog. As a proof-ofconcept of the LIFT possibilities, both inks were used to print entirely by LIFT a functional humidity sensor on a piece of paper.All the LIFT experiments were performed with a Nd:YAG laser that delivers pulses of a few hundreds of ns in an attempt to approach the technique to laser systems that are already introduced in many production lines for marking and labeling.

Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology. Excellent quality AgNP ink-junctions are ensured with high resolution picoliter drop jetting at low temperature ($150 C). Electrical, mechanical, and morphological characterizations are carried out to assess the performance of the AgNP ink junction. Moreover, AgNP ink is compared with common benchmark materials (i.e., silver epoxy and solder). Electrical contact resistance characterization shows a similar performance between the AgNP ink and the usual ones. Mechanical characterization shows comparable shear strength for AgNP ink and silver epoxy, and both present higher adhesion than solder. Morphological inspections by field-emission scanning electron microscopy confirm a high quality interface of the silver nanoparticle interconnection. Finally, a flexible hybrid circuit on paper controlled by an Arduino board is manufactured, demonstrating the viability and scalability of the AgNP ink assembling technique. Published by AIP Publishing.

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