Low-Cost Fabrication of Printed Electronics Devices through Continuous Wave Laser-Induced Forward Transfer

Sopeña, Pol; Arrese, Javier; González-Torres, Sergio; Fernández-Pradas, J.M.; Cirera, A.; Serra, P.

doi:10.1021/acsami.7b04409

Cited by 47 publications

(42 citation statements)

References 30 publications

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“…In fact, viscosities as high as tens and even hundreds of Pa s, well above the upper limit of aerosol jet printing, have been successfully printed through LIFT . Similarly, inks with loading particle size clearly beyond the limits of the aforementioned techniques are also perfectly printable through LIFT . Both instances are extremely interesting from a technological point of view.…”

Section: Lift From Liquid Donor Filmsmentioning

confidence: 99%

Laser‐Induced Forward Transfer: Fundamentals and Applications

Serra

Piqué

2018

Adv Materials Technologies

Self Cite

253

191

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Laser‐induced forward transfer (LIFT) is a digital printing technique that uses a pulsed laser beam as the driving force to project material from a donor thin film toward the receiving substrate whereon that material will be finally deposited as a voxel. This working principle allows LIFT to operate with both solid and liquid donor films, which provides the technique with an unprecedented broad spectrum of printable materials, and thus makes it very competitive over other digital technologies, like inkjet printing. It is not only that LIFT can access a much wider range of ink viscosities and loading particle sizes; the possibility of printing from solid films allows the single‐step printing of multilayers and entire devices, and even makes possible 3D printing. This versatility translates, in turn, into a broad field of applications, from graphics production to printed electronics, from the fabrication of chemical sensors to tissue engineering. This monograph provides an extensive review of the LIFT technique, from its origins to the most recent achievements, focusing on the fundamental aspects of both its working principle and transfer dynamics, as well as on its broad range of applications.

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Section: Lift From Liquid Donor Filmsmentioning

confidence: 99%

Laser‐Induced Forward Transfer: Fundamentals and Applications

Serra

Piqué

2018

Adv Materials Technologies

Self Cite

253

191

View full text Add to dashboard Cite

show abstract

“…There have been several attempts to improve this conventional method. P. Sopeña et al [23] presented LIFT using a CW laser and secured its possibility as a low-cost fabrication method, but this scheme also requires additional heat treatment because it does not include a simultaneous sintering process. Shin et al [15] introduced the shear-assisted laser transfer method using a CW laser, which utilizes the thermal expansion coefficient differences between the donor glass substrate and the acceptor Polydimethylsiloxane (PDMS) in conformal contact.…”

Section: Resultsmentioning

confidence: 99%

“…Some techniques that performed the SLS process with pulse laser or LIFT process with CW laser have been studied to overcome these innate limitations. P. Sopeña et al proposed the CW-LIFT method [23] and analyzed the dynamics of the method [24], which uses a CW laser for the LIFT of the liquid Ag NP ink, and F. Zacharatos et al [25] introduced a sintering method using a high-repetition-rate pulsed laser after the conventional LIFT method. However, both of these methods could not achieve the simultaneous sintering and transfer of the target material.…”

Section: Introductionmentioning

confidence: 99%

Continuous-Wave Laser-Induced Transfer of Metal Nanoparticles to Arbitrary Polymer Substrates

et al. 2020

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Laser-induced forward transfer (LIFT) and selective laser sintering (SLS) are two distinct laser processes that can be applied to metal nanoparticle (NP) ink for the fabrication of a conductive layer on various substrates. A pulsed laser and a continuous-wave (CW) laser are utilized respectively in the conventional LIFT and SLS processes; however, in this study, CW laser-induced transfer of the metal NP is proposed to achieve simultaneous sintering and transfer of the metal NP to a wide range of polymer substrates. At the optimum laser parameters, it was shown that a high-quality uniform metal conductor was created on the acceptor substrate while the metal NP was sharply detached from the donor substrate, and we anticipate that such an asymmetric transfer phenomenon is related to the difference in the adhesion strengths. The resultant metal electrode exhibits a low resistivity that is comparable to its bulk counterpart, together with strong adhesion to the target polymer substrate. The versatility of the proposed process in terms of the target substrate and applicable metal NPs brightens its prospects as a facile manufacturing scheme for flexible electronics.

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Section: Laser‐assisted Printing Techniquesmentioning

confidence: 99%

“…A noteworthy demonstration has proven the versatility of the LIFT for printing nanostructured materials, which is very promising in flexible electronics applications. An operative gas and temperature sensing circuits were fabricated on flexible (PI and paper) substrates by printing two nanostructured materials inks of very different particle size (carbon nanofibers as the gas sensing material and Ag ink as interdigitated electrodes) (Figure f) . This approach has a significant advantage over other printing techniques in that it allows broadening the range of nanostructured materials which can be directly printed without previously modifying the ink formulation (particle sizes/aspect ratios) that determine their unique functional properties.…”

Section: Laser‐assisted Printing Techniquesmentioning

confidence: 99%

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Bian

Zhou

Wan

et al. 2019

Adv Elect Materials

102

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materials and enable innovative applications that are hard to achieve with current microelectronics. Examples vary from biointegrated devices for clinical diagnosis and treatment, [11][12][13] to electronic skin (E-Skin), [14][15][16] energy harvesting/storage devices, [17][18][19][20][21] and sweat sensor, [22,23] to flexible display, [24,25] and to RFID tags, [26,27] etc.Two main kinds of microfabrication processes have been developed for flexible electronics, including the solutionprocessable methods and vacuum-based methods (lithographic patterning and undercut etching). [28] The former is naturally compatible with flexible substrates and can deposit and pattern functional materials in one single step. [29][30][31] They have fabricated various printed electronics with increasing performance, such as conductive metal wires, [32][33][34] thin film transistors (TFTs), [35][36][37] and piezoelectric devices. [38][39][40][41] However, the electronic performance is still limited by the properties of solution-processable functional materials and low resolution of printing techniques, with respect to standard microfabrication process. [42] On the other side, vacuum-based microfabrication techniques provide wellestablished routes to realize high-performance electronics, but generally incompatible with large-area, flexible (polymeric substrates). Ideally, high performance flexible electronics systems are usually fabricated by built-up process that begins with independent fabrication of high-modulus, fragile, chip-scale elements (e.g., IC chips, MEMS, sensors, and power sources) or flexible devices (e.g., flexible sensor, flexible display, and TFT array) on donor wafers, followed by being transferred onto flexible/stretchable substrates.The above manufacturing routes of flexible electronics can be concluded as the transfer of the materials, components, and devices from original fabricated/prepared substrates to flexible ones. The most significant built-in challenge in transferring is to control of interface status to accommodate to the disparate nature of the transferred objects from donor wafer/substrate. Distinctive assembly techniques based on stress-induced interface fracture have been invented to be adaptive to the diversity of material properties and geometric sizes that lead to tremendous differences in mechanical properties. For those conventional rigid electronic components like IC chips, they are transferred by standard single-ejector needle pick-and-place It is challenging to manufacture large-area, ultrathin, flexible/stretchable electronics on an industrial scale. Recent ground-breaking advances in the manufacture of flexible electronics are based on powerful laser processes. Laser irradiation at an internally absorbing interface through a transparent substrate will bring various physical changes and chemical reactions at the interface, accompanied by distinct phenomena. Numerous techniques derived from these phenomena with the unique ability to fabricate materials, structures, and devices on flexible subst...

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Low-Cost Fabrication of Printed Electronics Devices through Continuous Wave Laser-Induced Forward Transfer

Cited by 47 publications

References 30 publications

Laser‐Induced Forward Transfer: Fundamentals and Applications

Laser‐Induced Forward Transfer: Fundamentals and Applications

Continuous-Wave Laser-Induced Transfer of Metal Nanoparticles to Arbitrary Polymer Substrates

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

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