With the aim of preparing a high performance conductive ink, we sought to control the surface chemistry of Cu nanoparticles so as to minimize surface oxidation. Specifically, the surface oxide layer on Cu nanoparticles synthesized in ambient atmosphere was minimized by adjusting the molecular weight of poly(N‐vinylpyrrolidone) capping molecules, as confirmed by high resolution transmission electron microscopy and X‐ray photoelectron spectroscopy analyses. In addition, we demonstrate that by minimizing the thickness of the surface oxide layer, Cu granular films with good conductivity could be obtained by sintering nanoparticle assembles. Finally, we fabricated highly conductive Cu patterns on a plastic substrate by ink‐jet printing.
Direct printing methods have been used as manufacturing tools for printed electronics applications due to their cost effectiveness. In this review, the piezo-driven inkjet is discussed in detail since it is a mature technology and suitable for the production printing of printed electronics. In addition, other printing methods are considered for using higher viscosity ink and for producing smaller printed feature size. Various direct printing methods are compared in terms of jet mechanism, printing algorithm, and their applications. In particular high resolution printing methods using high viscosity inks, such as electrohydrodynamic jet, aerosol jet and micro-plotter are reviewed. To understand the recent status of industrial printing applications, display (liquid crystal display and organic light emitting diode) materials and printing issues are discussed. Finally, a brief overview of nano-particle metal based conductive inks is included because these inks have been widely used for printed electronics applications.
We have developed a Cu-Ag-based mixed metal conductive ink from which highly conductive tracks form on a flexible substrate after annealing at low temperature. Addition of small Ag particles significantly improves the particle packing density by filling the interstices formed between the larger Cu particles, which in turn facilitates better conductivity compared to pure Cu metal film. The particle size and volume ratio of the Ag particles added should be carefully controlled to achieve maximum packing density in the bimodal particle system, which is consistent with the theoretical considerations of the Furnas model. In addition, we demonstrate direct writing of complex patterns that exhibit high conductivity upon annealing at sufficiently low temperature (175-210 degrees C) to not damage the transparent plastic substrate such as polyethersulphone (PES).
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