Direct writing of copper conductive patterns by ink-jet printing

Park, Bong Kyun; Kim, Dongjo; Jeong, Sunho; Moon, Jooho; Kim, Jang Sub

doi:10.1016/j.tsf.2006.11.142

Cited by 492 publications

(299 citation statements)

References 28 publications

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“…1-Octanethiol was coated on the surface of CNPs for oxidation prevention, and the ink using these powders was prepared using 1-octanol as a solvent. The prepared ink was stable over 6 weeks as CH 3 chain length of solvent dramatically affects the stability of dispersion. For sintering, an intermediate temperature at 200°C step was found to be the optimum temperature to remove organic materials before sintering compared to the sample with an intermediate temperature at 150°C.…”

Section: Discussionmentioning

confidence: 99%

Synthesis of Conductive Nano Ink Using 1-Octanethiol Coated Copper Nano Powders in 1-Octanol for Low Temperature Sintering Process

2013

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A conductive nanoink was prepared using copper nanoparticles (CNPs). In order to prevent the oxidation of CNPs, the particles were coated by 1-octanethiol using Vaporized Self-Assembled Multi-layers (VSAMs) method. The coating of 1-octanethiol onto CNPs was confirmed by transmission electron microscope (TEM) and X-ray photoelectron spectroscopy (XPS). Dispersion stability of CNPs was checked by monitoring its viscosity over 6 weeks. The sheet-type of patterned samples using the fabricated ink was sintered at 350 and 230°C, respectively. Electrical resistivity was measured to be 5.69 © 10 ¹8 ³·m when sintered at 350°C and 7.67 © 10 ¹8 ³·m when sintered at 230°C. These results were 3.4 and 4.6 times than the value for bulk copper. During the sintering process, the optimum temperature of removing organic materials was found to be 200°C. This removal temperature dramatically influenced necking and the density of samples. Therefore, 1-octanethiol VSAMs and 1-octanol ink were used successfully for the low-temperature sintering process to fabricate conductive Cu patterns by finding the optimum temperature of 200°C for complete removal of organic materials prior to the sintering process.

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Section: Discussionmentioning

confidence: 99%

Synthesis of Conductive Nano Ink Using 1-Octanethiol Coated Copper Nano Powders in 1-Octanol for Low Temperature Sintering Process

2013

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“…However, copper nanoparticles are easily oxidized in air (Park et al 2007;Kanninen et al 2008), thereby spoiling bonding properties. To solve that problem, our research group previously developed methods for fabricating chemically stable copper metal particles.…”

Section: Introductionmentioning

confidence: 99%

Metal–metal bonding using silver/copper nanoparticles

et al. 2015

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A method for producing nanoparticles composed of silver and copper and a metal-metal bonding technique using the silver/copper nanoparticles are proposed. The method consists of three steps. First, copper oxide nanoparticles are produced by mixing Cu(NO 3 ) 2 aqueous solution and NaOH aqueous solution. Second, copper metal nanoparticles are fabricated by reducing the copper oxide nanoparticles with hydrazine in the presence of poly(vinylpyrrolidone) (PVP). Third, silver/copper nanoparticles are synthesized by reducing Ag ? ions with hydrazine in the presence of the copper metal nanoparticles. Initial concentrations in the final silver/copper particle colloid, composed of 0.0075 M Cu 2? , 0.0025 M Ag ? , 1.0 g/L PVP, and 0.6 M hydrazine, produced silver/copper nanoparticles with an average size of 49 nm and a crystal size of 16.8 nm. Discs of copper metal were successfully bonded by the silver/copper nanoparticles under annealing at 400°C and pressurizing at 1.2 MPa for 5 min in not only hydrogen gas but also nitrogen gas. The shear force required to separate the bonded discs was 22.3 MPa for the hydrogen gas annealing and 14.9 MPa for the nitrogen gas annealing (namely, 66.8 % of that for hydrogen gas annealing).

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“…Key components of printed electronics are conducting lines and films. Although conducting polymers could be used for these components, their conductivity and stability are still much inferior to those of their metallic counterparts [2][3][4]. Therefore, metal-based nanoinks have recently been introduced to alleviate these shortcomings.…”

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confidence: 99%

“…Therefore, Park et al [3] developed a low-viscosity conductive ink containing welldispersed copper nanoparticles through a polyol process. The inkjet printed nanoparticles were sintered at 325 • C for 1 h in vacuum to prevent oxidation [3]. However, the traditional thermal sintering still requires a high temperature, long cycle time and a vacuum chamber.…”

mentioning

confidence: 99%