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We present dual-band infrared image data collected as part of the Multidomain Smart Sensors effort at the U. S. Army Research Laboratory (ARL). The goal of this effort is to produce large-format, staring focal plane arrays (FPAs) that are able to see the battlefield in both the 3 to 5-µm (mid-wave infrared or MWIR) and 8 to 12-µm (long-wave infrared or LWIR) atmospheric transmission windows. The data was collected under laboratory and field test conditions using a simultaneously integrating, pixel-registered, 256 x 256, dual-band focal plane array produced by Lockheed Martin using quantum-well infrared photodetector (QWIP) technology. The dual-band FPA was installed in a camera that was taken in the field to gather image data on military targets. The pixel-registered dual-band FPA is well suited for the application of image fusion algorithms. We also applied some of these image fusion techniques to the imagery to enhance the visibility of targets.

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This paper describes a new approach for the control of microbolometer detector array uniformity as a function of substrate temperature change. This approach, called the bias equalization method, uses an electronic means of controlling the microbolometer array uniformity. For this method a three stage non-uniformity correction algorithm is employed. The first stage corrects for substrate temperature non-uniformity effects on the microbolometer detector elements followed by traditional offset and gain non-uniformity correction stages. To correct for substrate temperature non-uniformity effects, bias equalization coefficients are supplied to the readout integrated circuit (ROIC) to allow the control of a unique operating bias or temperature delta for each microbolometer detector element in the array. The bias equalization method circuitry allows microbolometer array non-uniformity control over a wider range of ROIC substrate temperatures while maintaining better than 8OmK NEdT using f/i .8 optics. This approach is expected to allow removal of the thermoelectric cooler from uncooled systems, thus making it ideally suited for high-volume, low-cost, low-power, and low-weight production applications.

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