The effect of a pulsed dc on the sintering of copper spheres to copper plates was investigated. It was shown that the current had a marked effect on neck growth between the spheres and the plates. The enhancement of sintering under the effect of the current was attributed to electromigration. Microstructural observations on fracture surfaces of necks formed under high currents showed considerable void formation. It was also observed that the current resulted in increased evaporation and the formation of bunched evaporation steps. Formation of these steps and their location relative to the neck were consistent with current density distributions. The results of this investigation provide direct evidence for the role of the current in the sintering in the pulse electric current sintering method.