Beams of electrons and ions are now fairly routinely focused to dimensions in the nanometer range. Since the beams can be used to locally alter material at the point where they are incident on a surface, they represent direct nanofabrication tools. The authors will focus here on direct fabrication rather than lithography, which is indirect in that it uses the intermediary of resist. In the case of both ions and electrons, material addition or removal can be achieved using precursor gases. In addition ions can also alter material by sputtering ͑milling͒, by damage, or by implantation. Many material removal and deposition processes employing precursor gases have been developed for numerous practical applications, such as mask repair, circuit restructuring and repair, and sample sectioning. The authors will also discuss structures that are made for research purposes or for demonstration of the processing capabilities. In many cases the minimum dimensions at which these processes can be realized are considerably larger than the beam diameters. The atomic level mechanisms responsible for the precursor gas activation have not been studied in detail in many cases. The authors will review the state of the art and level of understanding of direct ion and electron beam fabrication and point out some of the unsolved problems.

Dynamics of domain interfaces in a broad range of functional thin-film materials is an area of great current interest. In ferroelectric thin films, a significantly enhanced piezoelectric response should be observed if non-180 degrees domain walls were to switch under electric field excitation. However, in continuous thin films they are clamped by the substrate, and therefore their contribution to the piezoelectric response is limited. In this paper we show that when the ferroelectric layer is patterned into discrete islands using a focused ion beam, the clamping effect is significantly reduced, thereby facilitating the movement of ferroelastic walls. Piezo-response scanning force microscopy images of such islands in PbZr0.2Ti0.8O3 thin films clearly point out that the 90 degrees domain walls can move. Capacitors 1 microm2 show a doubling of the remanent polarization at voltages higher than approximately 15 V, associated with 90 degrees domain switching, coupled with a d33 piezoelectric coefficient of approximately 250 pm V-1 at remanence, which is approximately three times the predicted value of 87 pm V-1 for a single domain single crystal.

Ions of kiloelectron volt energies incident on a solid surface produce a number of effects: several atoms are sputtered off, several electrons are emitted, chemical reactions may be induced, atoms are displaced from their equilibrium positions, and ions implant themselves in the solid, altering its properties. Some of these effects, such as sputtering and implantation are widely used in semiconductor device fabrication and in other fields. Thus the capability to focus a beam of ions to submicrometer dimensions, i.e., dimensions compatible with the most demanding fabrication procedures, is an important development. The focused ion beam field has been spurred by the invention of the liquid metal ion source and by the utilization of focusing columns with mass separation capability. This has led to the use of alloy ion sources making available a large menu of ion species, in particular the dopants of Si and GaAs. The ability to sputter and to also induce deposition by causing breakdown of an adsorbed film has produced an immediate application of focused ion beams to photomask repair. The total number of focused ion beam fabrication systems in use worldwide is about 35, about 25 of them in Japan. In addition, there are many more simpler focused ion beam columns for specialized uses. The interest is growing rapidly. The following range of specifications of these systems has been reported: accelerating potential 3 to 200 kV, ion current density in focal spot up to 10 A/cm2, beam diameters from 0.05 to 1 μm, deflection accuracy of the beam over the surface ±0.1 μm, and ion species available Ga, Au, Si, Be, B, As, P, etc. Some of the applications which have been demonstrated or suggested include: mask repair, lithography (to replace electron beam lithography), direct, patterned, implantation doping of semiconductors, ion induced deposition for circuit repair or rewiring, scanning ion microscopy, and scanning ion mass spectroscopy.

We demonstrate the use of field-emission scanning electron microscopy for rapid imaging of small-diameter carbon nanotubes on insulating SiO 2 substrates. The image contrast stems from local potential differences between the nanotube and substrate and is insensitive to surface roughness and defects. This technique may also be used as a probe of the electrical connectivity of small structures without external leads.

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We report direct observation of controlled and reversible switching of magnetic domains using static (dc) electric fields applied in situ during Lorentz microscopy. The switching is realized through electromechanical coupling in thin film Fe(0.7)Ga(0.3)/BaTiO(3) bilayer structures mechanically released from the growth substrate. The domain wall motion is observed dynamically, allowing the direct association of local magnetic ordering throughout a range of applied electric fields. During application of approximately 7-11 MV/m electric fields to the piezoelectric BaTiO(3) film, local magnetic domains rearrange in the ferromagnetic Fe(0.7)Ga(0.3) layer due to the transfer of strain from the BaTiO(3) film. A simulation based on micromagnetic modeling shows a magnetostrictive anisotropy of 25 kPa induced in the Fe(0.7)Ga(0.3) due to the strain. This electric-field-dependent uniaxial anisotropy is proposed as a possible mechanism to control the coercive field during operation of an integrated magnetoelectric memory node.

A fundamental issue in ferroic systems (ferromagnetic and ferroelectric) is the scaling of the order parameter (magnetization or polarization) with size. Specifically, in ferroelectric thin films, deviations in the polarization can occur due to: (i) competition between thermal vibrations and the correlation energy (which aligns the dipoles); (ii) damage during fabrication. These deviations will have a profound impact on the performance of the next generation of high-density nonvolatile memories based on the spontaneous polarization. We have combined two novel approaches, namely focused ion beam milling to define sub-micron capacitors and scanning force microscopy to examine the scaling of the fundamental ferroelectric response of these capacitors. We find that the capacitors exhibit ferroelectric properties for lateral dimensions down to at least 100nm, suggesting that memories with densities in the range of 4-16 Gbits can be successfully fabricated.

General trends in integrated circuit technology toward smaller device dimensions, lower thermal budgets, and simplified processing steps present severe physical and engineering challenges to ion implantation. These challenges, together with the need for physically based models at exceedingly small dimensions, are leading to a new level of understanding of fundamental defect science in Si. In this article, we review the current status and future trends in ion implantation of Si at low and high energies with particular emphasis on areas where recent advances have been made and where further understanding is needed. Particularly interesting are the emerging approaches to defect and dopant distribution modeling, transient enhanced diffusion, high energy implantation and defect accumulation, and metal impurity gettering. Developments in the use of ion beams for analysis indicate much progress has been made in one-dimensional analysis, but that severe challenges for two-dimensional characterization remain. The breadth of ion beams in the semiconductor industry is illustrated by the successful use of focused beams for machining and repair, and the development of ion-based lithographic systems. This suite of ion beam processing, modeling, and analysis techniques will be explored both from the perspective of the emerging science issues and from the technological challenges.