Abstract-Carbon Nano Tubes (CNTs) have been widely proposed as interconnect fabric for nano and very deep submicron (silicon-based) technologies due to their robustness to electromigration. In this paper, a novel bus architecture with low crosstalk features is proposed. It is made of dual-walled nanotubes (DWNTs) arranged in parallel. It achieves reductions up to 72% of the crosstalk-induced delay, and up to 76% for the crosstalk-induced peak voltage, at a modest area increase. Therefore, the proposed bus arrangement significantly improves performance and provides reliable operation in an interconnect.
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