Summary. Integrated circuit technology started with printed circuits {packaging density: 1 component part/cm a) followed by micromodules (10 per cm a) and thin-film as well as thickfilm circuits (100 per cma). The most recent stage of development consists of integrated semiconductor units with a packaging density of 10 a through 105 component parts/cm a. In pacemakers the integrated circuit technology meets all requirements as regards magnitude and stability of electrical data as well as low power consumption and small volume.
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