Advanced Split Linear and Integral Stirling cryocoolers for JR applications are controlled by external or integrated control electronics to provide a stable preset temperature at the focal plane. AIM produces a family of Split Linear Stirling coolers with integrated control electronics inside the compressor housing.The new AM 7 electronic is standardized to one configuration which meets the different input power requirements and temperature settings of all AIM coolers ranging between lOW till 1 05W input power. AIM has completed the development of the AM 7 electronics to improve temperature stability over the entire range of operating conditions and to optimize ramp up of input power for different cool down conditions. Thus, reduced cooldown time at high ambients and softer startup at low temperatures are achieved. Optionally, the electronics can be supplemented with an external add-on microprocessor unit for advanced system requirements.The 3rd gen. electronics will be implemented into rate production 4Q2002. Downloaded From: http://proceedings.spiedigitallibrary.org/ on 06/27/2016 Terms of Use: http://spiedigitallibrary.org/ss/TermsOfUse.aspx Proc. of SPIE Vol. 4820 21 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 06/27/2016 Terms of Use: http://spiedigitallibrary.org/ss/TermsOfUse.aspx
To meet the demands for high performance infrared imaging systems AIM has developed a family ofCMT detector modules with linear focal plane arrays, integrated detector cooler assemblies (IDCA), and command and control electronics (CCE). Common features ofthese modules are focal plane multiplexers with time delay and integration (TDI) function, pixel deselect, programmable gain for each line, bidirectional scan capability, partitioning and global gain select. The family ofIDCA's consists either of single chip focal plane arrays (FPA) directly linked to a read out integrated multiplexer (ROIC) by solder bump technique, or one clip infrared detectors connected to one or more ROIC's using a multichip module (MCM) technique, dewars with optimized thermal heat load, coolers with integrated control electronics, and command and control electronics (CCE). The general design ofthese modules is outlined. Test results are shown.
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