The LED chips, packages and related materials have been already key issue on electronic applications and substitution of conventional lights. It is easily expected that the development trend of LED products is nearly the same as that of electronic products with higher performance, higher integration, lower energy and lower cost. And then we also prospect that the dissipated heat from LED chip is to be big problem for a reliability of products, as likely that electronic packages contain heat sink or heat spreader for controlling heat dissipation. In fact, the heat from an LED package with 1~3W LED chip shows a nearly 60~150°C, which affects thermal damage related to performance, joint failure, crack, etc. The thermal via was fabricated with 16 segments of via sizes ranged 0.2~1.2mm and via pitches ranged 0.5~3mm using 1~3W LED, respectively. The thermal resistivity was analyzed by the thermal transient tester with the variation of via sizes and pitches, which was also compared with the temperature difference of the top and bottom side of LED package. As a results, we convincingly proved the relationships between the design of thermal via and the heat dissipation of LED module, which were directly applicable to LED industry.
Light emitting diode (LED) has been largely used in industry of consumer electronics such as cell-phones, PDAs, and computers. Since all light sources convert electric power into radiant energy and heat, LED also does the same with an increase of its power. Generally, it only converts 15~25% of electric power into visible light; the rest of the power, 75~85%, is converted into heat. This excess heat should be conducted away from the LED die to circuit boards or heat sinks since heat affects directly performance of the LED. The piled heat in LED products brings color shift and reduces light output very rapidly. Furthermore, the lifecycle of LED products shorten if the heat problem continues. In order to prevent LED products from these negative effects, effective thermal resistance paths need to be achieved so that LED products let the heat conduct from the LED to the outside such as printed circuit board. In this research, optimization studies on thermal-via is to be performed. The 1W and 3W LED assembled printed circuit board with 16 different via designs is set up to measure its temperature for 4 hours in a real time. It was obtained by this work that the optimized thermal via was very effective to dissipate the heat from the LED.
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