Analysis on thermal resistance of LED module with various thermal vias

Shin, Hyeong Won; Lee, Hyo Soo; Jung, Seung Boo

doi:10.1109/ipfa.2011.5992760

Cited by 5 publications

(7 citation statements)

References 4 publications

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“…Light Emitting Diode (LED) is a semiconductor technology where light is emitted through to photon emission and is utilized in various products such as mobile, automobile and display units [1]. LEDs exhibit exceptional advantages such as high efficiency, bright light emission, long lifetime, energy saving properties and compact size over the existing incandescent lights [2].…”

Section: Introductionmentioning

confidence: 99%

“…In recent times, there are concerns on the reliability and efficieny of the LEDs by the manufaturing industry which are dominated by the heat generated within the LED package. Thus enforcing thermal management for LED package is significant to enhance the reliability of the LEDs [1,2]. The heat transfer of packaged LED was improved by Y.J Heo [3] where aluminum nitride (AlN) film were used to improve the heat transfer process.…”

Section: Introductionmentioning

confidence: 99%

“…The heat generated during light emission at the pn junction of the LED chip has to be dissipated out efficiently to the surrounding environment. [1][2][3][4][5]. Excessive heat will results in degradation of the optical output and lifetime of the LED [1][2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

“…[1][2][3][4][5]. Excessive heat will results in degradation of the optical output and lifetime of the LED [1][2][3][4][5]. Thus, the characterization of the LEDs heat dissipation is significant however it is tedious to be excuted through experimental work as it time consuming and costly.…”

Section: Introductionmentioning

confidence: 99%

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Natural Heat Convection Analysis on Cylindrical Al Slug of LED

Vairavan

Sauli

Retnasamy

et al. 2014

AMM

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This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug was carried out under natural convection condition at ambient temperature of 25°C. The junction temperature and the stress of the LED chip was assesed. The LED chip was powered with input power of 0.1 W and 1 W and the heat dissipation was assesed. Results showed that that the junction temperature and the Von Mises Stress of the single chip LED package increases with the increased input power.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Natural Heat Convection Analysis on Cylindrical Al Slug of LED

Vairavan

Sauli

Retnasamy

et al. 2014

AMM

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show abstract

“…High power light emitting diode (LED) initiated from the semiconductor technology are the latest light source which are being utilized in various products ranging from display to automobile industry [1]. However, the accession of power in LED light source has resulted thermal issue which causes low efficiency, operating lifetime degradation, thermal stress and product failure [2].…”

Section: Introductionmentioning

confidence: 99%

Heat Slug Material Variation Analysis on Thermal Dissipation of High Power LED

Retnasamy

Sauli

Vairavan

et al. 2014

AMR

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Accession of power in high power LED light source has resulted in thermal issue which causes reliability malfunction due to deficient heat dissipation. However, the heat disspation of high power LED can be enhance by improving packaging material selection.Thus, in this work, the connotation of heat slug material on the thermal performance of high power LED package was analyzed through simulation method. The significance of two heat slug materials, copper (Cu) and copper diamond (CuDia) were evaluated in terms of junction temperature, von Mises stress and thermal resistance. The simulation was executed using Ansys version 11 at ambient temperature of 25 °C with natural convection condition.

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A review of thermal management in power converters with thermal vias

Gautam

Wager

Musavi

et al. 2013

2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)

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One important challenge in power electronics design is removing the heat cost effectively from the power devices. A thermal via is a small diameter hole plated with copper and is used to transfer the heat from one side of the printed circuit board (PCB) to the other side. In this paper, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of devices in power electronics converters are presented. Key advantages of using PCB's for thermal management are also presented. Based on the conclusions drawn from the available literature and practical manufacturing guidelines, four different via patterns for a single power device are selected and their thermal performances are studied. Each of the four via patterns is laid out multiple times on the same PCB. A power component in a D2PAK is soldered to each of the patterns. The PCB is attached to a liquid cooled cold plate. The devices are powered up and a thermal imaging camera is used to record the temperature of the device. The experimental results presented closely matches with the theoretical prediction and helps in identifying the most efficient thermal via pattern.

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Analysis on thermal resistance of LED module with various thermal vias

Cited by 5 publications

References 4 publications

Natural Heat Convection Analysis on Cylindrical Al Slug of LED

Natural Heat Convection Analysis on Cylindrical Al Slug of LED

Heat Slug Material Variation Analysis on Thermal Dissipation of High Power LED

A review of thermal management in power converters with thermal vias

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