There are several types of welding method to join metal and ceramic. This paper gives a description of an experimental study of the ultrasonic welding of aluminum wire and silicon wafer under the conditions of the frequency of ultrasonic vibration f = 38000Hz, the applied duration T=0.2-1.5 sec, and the welding force Ps =40-140 gf.
In this study, vacuum deposition was first applied to deposit surface modification aluminum on silicon wafer, then ultrasonic welding processes were investigated to join aluminum wire and modified silicon wafer. Based on the results of the microstructure observation and tensile test, it is believed that the joining ability can be improved under optimum welding condition.
The main object of the present work was to develop an ultrasonic aided electrical
discharge grinding (UAEDG) methodology to remove the re-solidified layer through the grinding induced by a metal matrix composite electrode prior to the re-solidification of molten material. A metal matrix composite (Cu/SiCp) electrode, with an electroless pretreatment of Cu coating on SiCp to enhance bonding status between Cu and SiCp, was employed to study the UAEDG technology.
The machinability of the mold steel SKD11 was investigated by the combined technologies of UAEDG. The machined surfaces of these materials were examined by optical microscopy(OM)and their surface roughness measured by a profilemeter.
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