Abstract:There are several types of welding method to join metal and ceramic. This paper gives a description of an experimental study of the ultrasonic welding of aluminum wire and silicon wafer under the conditions of the frequency of ultrasonic vibration f = 38000Hz, the applied duration T=0.2-1.5 sec, and the welding force Ps =40-140 gf.
In this study, vacuum deposition was first applied to deposit surface modification aluminum on silicon wafer, then ultrasonic welding processes were investigated to join aluminum wi… Show more
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