We have developed an rf sputtering with multipolar magnets around the target in the rf sputtering system of a magnetic Ni (200 mmq, 5 mm thick) target to deposit Ni thinˆlms. When permanent magnets, made of Nd Fe B material with a surface magnetic ‰ux density of 0.57 T, were placed around the Ni target outside the vacuum chamber, a magnetic ‰ux density measured at the position of 5 mm above the target surface was distributed in the range of 0~0.37 T.It is shown that the deposition rate signiˆcantly increases from 3.7 to 5.4 nm/min with values increased up to two times that of a conventional rf sputtering. It is also revealed that the discharge produced by an rf sputtering with external magnets can be sustained at a lower Ar gas pressure of down to 8.0×10 -1 Pa.
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