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Sputter-deposited Au, Pt, Cr, Ni and Cu contacts for n-type GaN films were studied using current-voltage (I -V ) and capacitance-voltage (C-V ) measurements. These films were grown by molecular beam epitaxy (MBE), heteroepitaxially on the basal plane of sapphire. The contacts were non-ideally rectifying in nature. Assuming that the non-ideality was due to effects of series resistance and recombination current, a computer curve fitting procedure was employed that enabled the separation of these effects from the thermionic emission current, thereby permitting the calculation of the barrier height. An analysis of the results indicates that the barrier heights for metal contacts on GaN are determined by the difference between the metal and the semiconductor electronegativities and substantially influenced by metal induced gap states (MIGS)/sputtering damage induced surface states (SDISS). The concentration of metal induced gap states/sputtering induced damage states was determined to be approximately 2.7 × 10 13 states cm −2 eV −1 .

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Electrical contacts to both n and p-type GaN films have been investigated using electron-beam evaporated and sputtered films of metals such as Al, Au, Cr, Cu, Ni, Pt, and Ti. Films deposited by electron-beam evaporation for the n-type films with doping levels of 1 x 10 18 /cm 3 and lower showed rectifying characteristics with all the metals studied with the exception of Al. Aluminum contact diodes were ohmic in the as-deposited state. The Pt rectifying contact was near-ideal with an ideality factor close to 1.0. Ideality factors for the other metals were much greater than 1. This deviation from thermionic behavior was interpreted as space charge limited current conduction in the presence of deep-level states. Sputtered films showed very similar characteristics to electron-beam deposited films, with the exception of Ti. The Ti contact was ohmic in the as-deposited state. Non-linear Cu contacts to n-type films became ohmic on annealing. However, for p-type films, Ar ion sputter-cleaning prior to metal deposition by sputtering created ohmic contacts with Cu and Pt. Low resistance ohmic contacts were achieved by ion implantation and anneal of Si in n-type and Mg in p-type films, prior to metallization. The implant parameters and anneal temperatures are currently being optimized.

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