In this study, we evaluated changes in physicochemical properties, total phenol and isoflavone contents, and antioxidant activity during soymilk fermentation by a potential probiotic Lactobacillus plantarum P1201. The P1201 strain showed survival rates of 58.14% and 62.22% after 4 h exposure to acid and artificial gastric acid conditions (pH 2.5), respectively. The optimal conditions for soy-yogurt fermentation by L. plantarum were determined to be as follows: temperature of 35 o C, seed volume of 5.0%, and sucrose content of 10.0%. The total phenol and isoflavone contents and antioxidant activity were higher in soy-powder milk (SPM) yogurt than soymilk yogurt. In particular, the highest levels of isoflavone-aglycones, such as daidzein, glycitein, and genistein (91.50, 12.34, and 61.39 µg/g, respectively), were observed after 48 h of SPM fermentation. Thus, these results suggest that the soy-yogurt extract could be used as a potential source of natural antioxidants in food. Each isolated strains was tested in triplicate for its tolerance in acidified and artificial gastric acidified MRS broth. Means with different lowercase letters (a, b, and c) indicate significant differences of incubation times by Tukey's multiple range test (p<0.05).
항산화 활성이 증진된 두유-요구르트
559후 88.52 및 59.57%의 생존율을 나타내었고 P1201 균주는 92.56 및 62.22%의 생존율을 나타내어 S48 균주보다 우수한 것으로 나 타났다( Table 1) Table 2). 정확한 균주 동정을 위하여 16S rRNA 염기서열 분석을 수행 하였다. P1201 균주의 염기서열을 결정하여 phylogenetic tree 분 석 결과 L. plantarum WCFS1 (AL935263)와 99.0%로 가장 유사 성이 높았다 (Fig. 1). 형태학적, 생리학적, 세포 지방산 조성, 생화 학적 및 분자유전학적 특성을 비교 검토하여 최종적으로 L. plantarum P1201로 명명하였다.
두유 요구르트 발효 중 이화학적 특성 변화배양온도 ( Table 3. Changes of pH, acidity and viable cell numbers during soy milk (SM) and soy powder milk (SPM) fermentations
The effect of a trace Al addition (0, 0.01, 0.05 and 0.1 wt. %) in the Sn-2Ag-5Bi solder alloy on wettability and intermetallic compound (IMC) formation of the alloy was investigated. The interface between the solder and a Cu(17 µm)/Ni(4 µm)/Au (0.02 µm) under bump metallized (UBM) substrate was studied. The microstructure of the bulk solder and the interface of the soldered joints was observed in a scanning electron microscope (SEM), and the thickness of the interface reaction layers was estimated. Various IMC phases were identified by energy dispersive spectroscopy (EDS) and by the electron probe micro analyzer (EPMA). The experimental results indicated that the addition of 0.01 wt. % Al in the Sn-2Ag-5Bi solder alloy significantly improved the wettability of the solder more than the other Al additions did. The IMC layer between the bulk Sn-2Ag5Bi-0.01Al solder and the Cu/Ni/Au UBM substrate was almost uniform and thinner than those between the solders containing 0, 0.05, and 0.1 wt. % Al and their respective Cu/Ni/Au UBM substrates. Furthermore, the growth rate of the IMC layer between the Sn-2Ag-5Bi-0.01Al solder and Cu/Ni/Au UBM after 1 to 10 reflow times was lower than that of the IMC layer between the Sn-2Ag-5Bi solder and Cu/Ni/Au UBM. The IMCs in the solder joint interface (e.g., Ni3Sn4) of the Sn-2Ag-5Bi-0.01Al solder were well distributed near the Bi and fine Ag3Sn. The addition of 0.01 wt. % Al in the Sn-2Ag-5Bi solder yielded the best wetting properties for the solder and the minimum growth rate of the IMCs because it increased the nucleation rate of Ag3Sn and uniformly segregated the Bi phase.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.