Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered joints

Lee, Hee Yul; Sharma, Ashutosh; Kee, Se Ho; Lee, Young Woo; Moon, Jung Tak; Jung, Jae Pil

doi:10.1007/s13391-014-3364-7

Cited by 34 publications

(19 citation statements)

References 24 publications

(25 reference statements)

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“…After 10 reflows, the total IMCs of the Sn-0.7Cu solder had grown the most significantly. This appears to have occurred because the Al compounds present near the grain boundary or interface inhibited the formation and growth of interfacial IMCs by blocking the diffusion of Sn and Cu atoms [ 31 , 32 ]. Cu 3 Sn IMCs were similarly observed in all three solders.…”

Section: Resultsmentioning

confidence: 99%

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

et al. 2021

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In this study, the interfacial reactions and mechanical properties of solder joints after multiple reflows were observed to evaluate the applicability of the developed materials for high-temperature soldering for automotive electronic components. The microstructural changes and mechanical properties of Sn-Cu solders regarding Al(Si) addition and the number of reflows were investigated to determine their reliability under high heat and strong vibrations. Using differential scanning calorimetry, the melting points were measured to be approximately 227, 230, and 231 °C for the SC07 solder, SC-0.01Al(Si), and SC-0.03Al(Si), respectively. The cross-sectional analysis results showed that the total intermetallic compounds (IMCs) of the SC-0.03Al(Si) solder grew the least after the as-reflow, as well as after 10 reflows. Electron probe microanalysis and transmission electron microscopy revealed that the Al-Cu and Cu-Al-Sn IMCs were present inside the solders, and their amounts increased with increasing Al(Si) content. In addition, the Cu6Sn5 IMCs inside the solder became more finely distributed with increasing Al(Si) content. The Sn-0.5Cu-0.03Al(Si) solder exhibited the highest shear strength at the beginning and after 10 reflows, and ductile fracturing was observed in all three solders. This study will facilitate the future application of lead-free solders, such as an Sn-Cu-Al(Si) solder, in automotive electrical components.

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Section: Resultsmentioning

confidence: 99%

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

et al. 2021

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“…In view of the various concerns raised by the electronic research community, such as according to European Directives, use of lead-bearing solders is restricted in consumer electronics due to the environmental and health hazard nature of Pb [17][18][19][20][21][22] . In view of these concerns, lead-free regulations have been passed worldwide in the last few decades.…”

Section: Lead-free Solderingmentioning

confidence: 99%

Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications

Sharma

Jung²,

Cheon³

et al. 2019

Journal of Welding and Joining

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Epoxy solder pastes are widely used in microelectronic packaging for joining die, interconnects, screen displays and as a heat dissipaters. Due to their simplicity and high reliability in chip or package bonding, epoxy solder pastes have been recently paid great attention as a competitive bonding material. The epoxy-based pastes are composed of conducting fillers (solder powder, metallic particles) mixed with epoxy polymer. The bonded joint is robust and has a higher strength after the curing of the epoxy polymer during joining. The inclusion of epoxy as a matrix also alleviate the problem of short-circuiting caused by metallic whisker formation. In view of these advantages, epoxy solder is highly attractive amongst electronic packages and in automotive cars. In this review, we have summarized the background and recent developments in the field of epoxybased solder pastes for electronic and automotive interconnection. Further improvements to improve this technology is also discussed in detail.

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“…[101] Tin based contacts are generally susceptible to fretting wear which is a prime concern in automobile applications. [102,103] …”

Section: Wear and Friction Behaviormentioning

confidence: 99%

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Sharma¹,

Das²,

Das³

2016

Electrodeposition of Composite Materials

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This chapter provides a detailed overview of the various Sn-based composites solders reinforced with ceramic nanoparticles. These solders are lead free in nature and are produced by various process like powder metallurgy, ball milling, casting as well as simple and economic pulse co-electrodeposition technique. In this chapter, various electrodeposited composite solders, their synthesis, characterization, and evaluation of various properties for microelectronic packaging applications, such as microstructure, microhardness, density and porosity, wear and friction, electrochemical corrosion, melting point, electrical resistivity, and residual stress of the monolithic Sn-based and (nano)composite solders have been presented and discussed. This chapter is divided into the following sections: such as introduction to microelectronic packaging, synthesis routes for solders and composites, various nanoreinforcement, and the mechanism of incorporation in solder matrix, the pulse co-electrodeposition technique, the various factors affecting composite deposition, and the improved properties of composite solders over monolithic solders for microelectronic packaging applications are also summarized here.

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Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered joints

Cited by 34 publications

References 24 publications

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

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