The effects of the electroforming polarity on the bipolar resistive switching characteristics in SrTiO3−δ thin films have been investigated. The conduction mechanisms of high resistance state and low resistance state are Poole–Frenkel emission and tunneling, respectively. The temperature dependences of the resistance at high and low resistance state are both semiconductorlike. The impact of the polarity of the electroforming voltage on the resistive switching mechanism and the distribution of defects was discussed. A simple model describing the combination of bulk and the interface effect was proposed to explain the resistive switching in this material.

Well-developed bipolar resistive switching behaviors have been revealed in Pt/GaOx/ITO stacks without an electroforming process. By substituting platinum with titanium as the top electrode, switching polarity changed from “counter-Figure-8” to “Figure-8.” The modulation of Schottky barrier at the Pt/GaOx interface induced by migration of oxygen vacancies was proposed to explain the switching in Pt/GaOx/ITO stacks, while the switching in Ti/GaOx/ITO stacks was ascribed to the redox reaction at the Ti/GaOx interface. Our experimental result further confirms the migration of oxygen vacancies in the vicinity of the electrode area plays an important role in the resistive switching process.

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A charge trapping memory device using Ti0.2Al0.8Ox film as charge trapping layer and amorphous Al2O3 as the tunneling and blocking layers was fabricated for nonvolatile memory application. TiAl2O5 nanocrystals are precipitated from the phase separation of Ti0.2Al0.8Ox film annealed at 900 °C. A memory window of 2.3 V and a stored electron density of 1×1013/cm2 were obtained. Good retention characteristics of the memory device at 80 °C were observed due to the deep charge trapping level as identified by the valence band offsets and electron energy loss spectrum measurements.