In this paper, we studied wet chemical etching fabrication of the InAs/GaSb superlattice mesa photodiode for the mid-infrared region. The details of the wet chemical etchants used for the device process are presented. The etching solution is based on orthophosphoric acid (H 3 PO 4 ), citric acid (C 6 H 8 O 7 ) and H 2 O 2 , followed by chemical polishing with the sodium hypochlorite (NaClO) solution and protection with photoresist polymerized. The photodiode performance is evaluated by current-voltage measurements. The zero-bias resistance area product R 0 A above 4 × 10 5 cm 2 at 77 K is reported. The device did not show dark current degradation at 77 K after exposition during 3 weeks to the ambient air.
We report on structural, electrical, and optical characterizations of midwave infrared InAs/GaSb superlattice (SL) p-i-n photodiodes. High-quality SL samples, with 1 μm thick active region (220 SL periods), exhibited a cut-off wavelength of 4.9 μm at 80 K. Using a capacitance-voltage measurement technique performed on mesa diode, the residual background concentration in the nonintentionally doped region was determined to be 3×1015 cm−3 at 80 K. Extracted from current-voltage characteristics, R0A products above 4×105 Ω cm2 at 80 K were measured, and the quantitative analysis of the J-V curves showed that the dark current density of SL photodiode is dominated by generation-recombination processes. Front-side illuminated photodiodes produced responsivity at 80 K equal to 360 mA/W at 4.5 μm.
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